Optical sensor device

Abstract

A package for an optical sensor device has a double molding structure in which a first resin molded portion ( 1 ) and a second resin molded portion ( 2 ) are subjected to contact fitting. The first resin molded portion ( 1 ) has a structure in which peripheries of a die pad portion ( 8 ) on which an optical sensor element ( 5 ) is mounted and a part of leads ( 3 a, 3 b ) are molded with a resin so as to be integrated. The second resin molded portion ( 2 ) has a structure in which the periphery of the first resin molded portion ( 1 ) is molded with a resin so as to form an outer shape. When a cavity is formed, a glass substrate ( 4 ) having a filter function and an upper surface of the resin molded portions are bonded to each other to form a cavity structure.

What is claimed is: 
     
         1 . An optical sensor device, comprising a package having an optical sensor element mounted thereon, the package comprising a package body having a double molding structure, a lid, and a cavity formed between the lid and a bottomed portion on an inner side of the package body,
 the package body comprising:
 a first resin molded portion comprising an element mounting portion on which the optical sensor element is mounted at a center of the bottomed portion, the first resin molded portion being integrated with a part of a lead, excluding a wire bonding portion, by subjecting a periphery of the part of the lead to contact fitting molding through use of a resin; and 
 a second resin molded portion in which a periphery of the first resin molded portion and a periphery of another part of the lead are subjected to contact fitting molding, 
   the lid being formed of a glass substrate having a filter function and being subjected to adhesion fitting in an uppermost portion of the package body,   the first resin molded portion forming the bottomed portion and a first inner side surface continued from the bottomed portion,   the second resin molded portion forming a second inner side surface continued from the first inner side surface and an outer shape of the package.   
     
     
         2 . An optical sensor device, comprising a package having an optical sensor element mounted thereon, the package comprising a package body having a double molding structure, a lid, and a cavity formed between the lid and a bottomed portion on an inner side of the package body,
 the package body comprising:
 a first resin molded portion comprising a die pad portion on which the optical sensor element is mounted at a center of the bottomed portion, the first resin molded portion being integrated with a part of the die pad portion, excluding a surface on which the optical sensor element is mounted, and a part of a lead, excluding a wire bonding portion, by subjecting a periphery of the part of the die pad portion and a periphery of the part of the lead to contact fitting molding through use of a resin; and 
 a second resin molded portion in which a periphery of the first resin molded portion and a periphery of another part of the lead are subjected to contact fitting molding, 
   the lid being formed of a glass substrate having a filter function and being subjected to adhesion fitting in an uppermost portion of the package body,   the first resin molded portion forming the bottomed portion and a first inner side surface continued from the bottomed portion,   the second resin molded portion forming a second inner side surface continued from the first inner side surface and an outer shape of the package.   
     
     
         3 . An optical sensor device, comprising a package having an optical sensor element mounted thereon, the package comprising a package body having a double molding structure, a lid, and a cavity formed between the lid and a bottomed portion on an inner side of the package body,
 the package body comprising:
 a first resin molded portion integrated with a part of a lead, excluding a wire bonding portion, by subjecting a periphery of the part of the lead to contact fitting molding through use of a resin; and 
 a second resin molded portion in which a periphery of the first resin molded portion and a periphery of another part of the lead are subjected to contact fitting molding, the second resin molded portion comprising an element mounting portion on which the optical sensor element is mounted at a center of the bottomed portion, 
   the lid being formed of a glass substrate having a filter function and being subjected to adhesion fitting in an uppermost portion of the package body,   the first resin molded portion forming a periphery of the bottomed portion and a first inner side surface continued from the periphery of the bottomed portion,   the second resin molded portion forming a center of the bottomed portion, a second inner side surface continued from the first inner side surface, and an outer shape of the package.   
     
     
         4 . An optical sensor device, comprising a package having an optical sensor element mounted thereon, the package comprising a package body having a double molding structure, a lid, and a cavity formed between the lid and a bottomed portion on an inner side of the package body,
 the package body comprising:
 a first resin molded portion integrated with a part of a lead, excluding a wire bonding portion, by subjecting a periphery of the part of the lead to contact fitting molding through use of a resin; and 
 a second resin molding portion in which a periphery of the first resin molded portion and a periphery of another part of the lead are subjected to contact fitting molding, the second resin molding portion comprising an element mounting portion on which the optical sensor element is mounted at a center of the bottomed portion, 
   the lid being formed of a glass substrate having a filter function and being subjected to adhesion fitting in an uppermost portion of the package body,   the first resin molded portion being completely covered with the second resin molded portion,   the wire bonding portion being exposed from the second resin molded portion.   
     
     
         5 . An optical sensor device according to  claims 1 ,
 wherein the first resin molded portion is formed of one of a thermoplastic resin and a thermosetting resin, and has a light-blocking property, and   wherein the first resin molded portion has heat resistance equal to or higher than heat resistance of a resin to be used for the second resin molded portion.   
     
     
         6 . An optical sensor device according to  claim 1 , wherein the second resin molded portion is formed of one of a thermoplastic resin and a thermosetting resin, and has one of a light-blocking property, reflectivity, and a filter function of absorbing and transmitting light having a specified wavelength. 
     
     
         7 . An optical sensor device according to  claim 1 , wherein the first resin molded portion after being molded comprises an outer periphery having one of an uneven shape and a plurality of concave shapes following the outer periphery, obtained by molding, on a surface that is brought into contact with the second resin molded portion, to thereby form a contact fitting molding structure between the outer periphery and the second resin molded portion. 
     
     
         8 . An optical sensor device according to  claim 2 , wherein the die pad portion comprises a suspension lead that is exposed from a side surface of the first resin molded portion without being exposed from a side surface of the second resin molded portion. 
     
     
         9 . An optical sensor device according to  claim 2 , wherein the die pad portion comprises a bottom surface that is exposed from a surface of the second resin molded portion corresponding to a back surface of the package body. 
     
     
         10 . An optical sensor device according to  claim 9 , wherein the bottom surface of the die pad portion is exposed without being covered with a resin forming the second resin molded portion.