Heat sink

Abstract

A heat sink that can reduce a load imposed on a heat pipe and enhance a heat transfer efficiency from a heating body to a heat radiation fin is provided. The heat sink has a base plate 21 having a heat receiving portion to which a semiconductor device 11 is thermally connected, a heat pipe disposed on the base plate 21 while partially brought into contact with the heat receiving portion, and a heat radiation fin arranged to be stacked on the base plate 21 and the heat pipe 22 . The base plate 21 is formed of a metal plate and has an opening portion 35 at the site corresponding to the heat receiving portion, and the heat receiving plate 36 which is formed of a metal plate having higher thermal conductivity than the base plate 21 is arranged to form substantially the same plane with the base plate 21.

1 . A heat sink comprising:
 a base plate having a heat receiving portion to which a heating body is thermally connected;   a heat pipe disposed on the base plate while partially brought into contact with the heat receiving portion; and   a heat radiation fin disposed to be stacked on the base plate and the heat pipe,   wherein the base plate is formed by folding a metal plate, and has a groove portion on which the heat pipe is mounted, and a mount portion which is located at both the sides of the groove portion and on which the heat radiation fin is mounted, an opening portion is formed at a site corresponding to the heat receiving portion of the groove portion, and a surface of the groove portion and a back surface of the mount portion are formed at the same height, and the heat receiving portion formed of a metal plate having higher thermal conductivity than the base plate is placed at the opening portion so that one surface of the heat receiving plate and a surface of the base plate on which the heat pipe is mounted form substantially the same plane.   
     
     
         2 . (canceled) 
     
     
         3 . The heat sink according to  claim 1 , wherein the heat receiving plate is fixed to the back surface of the mount portion. 
     
     
         4 . The heat sink according to  claim 1 , wherein the heat radiation fin has a plurality of fin plates equipped side by side, and the fin plates are arranged along an extension direction of the heat pipe. 
     
     
         5 . The heat sink according to  claim 1 , wherein the heat radiation fin has a plurality of reception grooves for receiving the heat pipe on a surface thereof which confronts the base plate, and a leg portion that comes into contact with the surface of the base plate is equipped between the reception grooves. 
     
     
         6 . The heat sink according to  claim 3 , wherein the heat radiation fin has a plurality of fin plates equipped side by side, and the fin plates are arranged along an extension direction of the heat pipe. 
     
     
         7 . The heat sink according to  claim 3 , wherein the heat radiation fin has a plurality of reception grooves for receiving the heat pipe on a surface thereof which confronts the base plate, and a leg portion that comes into contact with the surface of the base plate is equipped between the reception grooves. 
     
     
         8 . The heat sink according to  claim 4 , wherein the heat radiation fin has a plurality of reception grooves for receiving the heat pipe on a surface thereof which confronts the base plate, and a leg portion that comes into contact with the surface of the base plate is equipped between the reception grooves.