Polishing composition

Abstract

To provide a means by which polishing rate can further be improved in a polishing composition to be used for an application of polishing an object to be polished containing a metal element or a semimetal element. Oxo acid containing a metal element or a semimetal element, and water are contained in a polishing composition to be used for an application of polishing an object to be polished containing a metal element or a semimetal element.

1 . A polishing composition to be used for an application of polishing an object to be polished comprising a metal element or a semimetal element, comprising:
 an oxo acid comprising a metal element or a semimetal element; and   water.   
     
     
         2 . The polishing composition according to  claim 1 , wherein
 the object to be polished comprises a phase change alloy, and   the oxo acid comprises a semimetal element.   
     
     
         3 . The polishing composition according to  claim 2 , wherein the phase change alloy is a germanium-antimony-tellurium alloy. 
     
     
         4 . The polishing composition according to  claim 1 , wherein the oxo acid comprises tellurium as a semimetal element. 
     
     
         5 . The polishing composition according to  claim 1 , wherein the object to be polished comprises a metal layer comprising a metal element. 
     
     
         6 . The polishing composition according to  claim 5 , wherein the metal layer comprises tungsten. 
     
     
         7 . The polishing composition according to  claim 1 , wherein the oxo acid and the object to be polished comprise the same metal element or semimetal element. 
     
     
         8 . The polishing composition according to  claim 1 , further comprising a non-metallic oxidizing agent. 
     
     
         9 . The polishing composition according to  claim 1 , further comprising a polishing accelerator. 
     
     
         10 . A polishing method, comprising a step of polishing an object to be polished comprising a metal element or a semimetal element with the polishing composition set forth in  claim 1 . 
     
     
         11 . A method for producing a substrate, comprising a step of polishing an object to be polished comprising a metal element or a semimetal element by the polishing method set forth in  claim 10 .