Organic-inorganic complex, and forming composition thereof
Abstract
An organic-inorganic complex-forming composition that includes: a) an organic silicon compound represented by R n SiX 4-n wherein R represents an organic group having a carbon atom directly bonded to Si, and X represents a hydroxyl group or a hydrolyzable group; and n represents 1 or 2, wherein when n is 2, each R is the same or different, and when (4−n) is 2 or more, each X is the same or different and having a solubility parameter (SP1) of R obtained by Fedors' estimation method smaller than a solubility parameter (SP2) of a thermosetting compound obtained by Fedors' estimation method, and a difference between the SP1 and the SP2 is 1.6 or more (Si1), and/or a condensate thereof; and b) a thermosetting compound (excluding an olefin polymer).
Claims
exact text as granted — not AI-modified1 . An organic-inorganic complex-forming composition comprising:
a) an organic silicon compound that is at least one represented by formula (I)
R n SiX 4-n (I)
(wherein R represents an organic group having a carbon atom directly bonded to Si, and X represents a hydroxyl group or a hydrolyzable group; and n represents 1 or 2, wherein when n is 2, each R is the same or different, and when (4−n) is 2 or more, each X is the same or different) and having a solubility parameter (SP1) of R obtained by Fedors' estimation method smaller than a solubility parameter (SP2) of a thermosetting compound obtained by Fedors' estimation method, and a difference between the SP1 and the SP2 is 1.6 or more (Si1), and/or a condensate thereof; and b) a thermosetting compound (excluding an olefin polymer).
2 . An organic-inorganic complex-forming composition comprising:
a) an organic silicon compound that is at least one represented by formula (I)
R n SiX 4-n (I)
(wherein R represents an organic group having a carbon atom directly bonded to Si, X represents a hydroxyl group or a hydrolyzable group; and n represents 1 or 2, wherein when n is 2, each R is the same or different, and when (4−n) is 2 or more, each X is the same or different), wherein a molar ratio of an organic silicon compound (Si1) in which a solubility parameter (SP1) of R obtained by Fedors' estimation method is smaller than a solubility parameter (SP2) of a thermosetting compound obtained by Fedors' estimation method, and a difference between the SP1 and the SP2 is 1.6 or more to an organic silicon compound (Si2) in which SP1 is smaller than SP2 and a difference between the SP1 and the SP2 is less than 1.6 or an organic silicon compound (Si2) in which SP1 is larger than SP2 (Si1:Si2) is 5:5 to 10:0, and/or a condensate thereof; and b) a thermosetting compound (excluding an olefin polymer).
3 . An organic-inorganic complex comprising:
a) a condensate of an organic silicon compound that is at least one represented by formula (I)
R n SiX 4-n (I)
(wherein R represents an organic group having a carbon atom directly bonded to Si, and X represents a hydroxyl group or a hydrolyzable group; and n represents 1 or 2, wherein when n is 2 each R is the same or different, and when (4−n) is 2 or more, each X is the same or different) and having a solubility parameter (SP1) of R obtained by Fedors' estimation method smaller than a solubility parameter (SP2) of a thermosetting compound obtained by Fedors' estimation method, and a difference between the SP1 and the SP2 is 1.6 or more (Si1); and b) a cured material of the thermosetting compound (excluding a cured material of an olefin polymer).
4 . An organic-inorganic complex comprising:
a) a condensate of an organic silicon compound that is at least one represented by formula (I)
R n SiX 4-n (I)
(wherein R represents an organic group having a carbon atom directly bonded to Si, and X represents a hydroxyl group or a hydrolyzable group; and n represents 1 or 2, wherein when n is 2 each R is the same or different, and when (4−n) is 2 or more, each X is the same or different), wherein a molar ratio of an organic silicon compound (Si1) in which a solubility parameter (SP1) of R obtained by Fedors' estimation method is smaller than a solubility parameter (SP2) of a thermosetting compound obtained by Fedors' estimation method, and a difference between the SP1 and the SP2 is 1.6 or more to an organic silicon compound (Si2) in which SP1 is smaller than SP2 and the difference between the SP1 and the SP2 is less than 1.6 or an organic silicon compound (Si2) in which SP1 is larger than SP2 (Si1:Si2) is 5:5 to 10:0; and b) a cured material of the thermosetting compound (excluding a cured material of an olefin polymer).
5 . A laminated body obtained by applying an organic-inorganic complex-forming composition according to claim 1 to a substrate.
6 . A laminated body obtained by applying an organic-inorganic complex-forming composition according to claim 2 to a substrate.Join the waitlist — get patent alerts
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