Stacked interconnect heat sink

Abstract

A method is provided. The method includes providing an integrated circuit having a substrate. The method also includes locating a via within the substrate. The method further includes connecting the via to a corresponding heat spreader via. The corresponding heat spreader via may pass through a thermally conductive core of a heat spreader.

What is claimed is: 
     
         1 . A method of forming an electronic device, comprising:
 providing an integrated circuit having a substrate;   locating an active via within said substrate; and   connecting said active via to a corresponding heat spreader via that passes through a thermally conductive core of a heat spreader.   
     
     
         2 . The method as recited in  claim 1 , wherein said thermally conductive core is an electrically conductive layer. 
     
     
         3 . The method as recited in  claim 2 , further comprising locating a dielectric layer between said heat spreader via and said thermally conductive core, and forming a solder pad on a surface of said thermally conductive core. 
     
     
         4 . The method as recited in  claim 1 , wherein said thermally conductive core is an electrically insulating layer. 
     
     
         5 . The method as recited in  claim 4 , further comprising forming a metallurgical connection between a heat spreader plug located within said electrically insulating layer with a substrate plug located within said substrate. 
     
     
         6 . The method as recited in  claim 1 , further comprising locating a substrate plug within said substrate and connecting said substrate plug to said heat spreader. 
     
     
         7 . A method of forming an electronic device, comprising:
 providing an integrated circuit having a substrate;   locating a via within said substrate; and   connecting said via to a corresponding heat spreader via that passes through a thermally conductive core of a heat spreader.   
     
     
         8 . The method as recited in  claim 7 , wherein said thermally conductive core is an electrically conductive layer. 
     
     
         9 . The method as recited in  claim 8 , further comprising locating a dielectric layer between said heat spreader via and said thermally conductive core, and forming a solder pad on a surface of said thermally conductive core. 
     
     
         10 . The method as recited in  claim 7 , wherein said thermally conductive core is an electrically insulating layer. 
     
     
         11 . The method as recited in  claim 10 , further comprising forming a metallurgical connection between a heat spreader plug located within said electrically insulating layer with a substrate plug located within said substrate. 
     
     
         12 . The method as recited in  claim 7 , further comprising locating a substrate plug within said substrate and connecting said substrate plug to said heat spreader. 
     
     
         13 . A method, comprising:
 providing an integrated circuit having a substrate;   locating a via within said substrate; and   connecting said via to a corresponding heat spreader via.   
     
     
         14 . The method as recited in  claim 13 , wherein said corresponding heat spreader via passes through a thermally conductive core of a heat spreader. 
     
     
         15 . The method as recited in  claim 14 , wherein said thermally conductive core is an electrically conductive layer. 
     
     
         16 . The method as recited in  claim 15 , further comprising locating a dielectric layer between said heat spreader via and said thermally conductive core, and forming a solder pad on a surface of said thermally conductive core. 
     
     
         17 . The method as recited in  claim 14 , wherein said thermally conductive core is an electrically insulating layer. 
     
     
         18 . The method as recited in  claim 17 , further comprising forming a metallurgical connection between a heat spreader plug located within said electrically insulating layer with a substrate plug located within said substrate. 
     
     
         19 . The method as recited in  claim 14 , further comprising locating a substrate plug within said substrate and connecting said substrate plug to said heat spreader. 
     
     
         20 . The method as recited in  claim 13 , wherein said via is an active via.