Semiconductor device, manufacturing method thereof, and mobile telephone

Abstract

Provided is a technology capable of inhibiting a shield film formed over a surface of a sealing body from peeling from the surface of the sealing body, and inhibiting a part of the shield film from bulging from the surface of the sealing body. The present invention is characterized in that a peeling-prevention-mark formation region is provided so as to surround a product-identification-mark formation region, and a plurality of peeling prevention marks are formed in the peeling-prevention-mark formation region. That is, the present invention is characterized in that the region of the surface region of the sealing body which is different from the product-identification-mark formation region is defined as the peeling-prevention-mark formation region, and the peeling prevention marks are formed in the peeling-prevention-mark formation region.

What is claimed is: 
     
         1 . A method of manufacturing a semiconductor device, comprising the steps of:
 (a) providing a wiring board in which a reference wiring line for supplying a reference potential is formed;   (b) after the step (a), mounting a semiconductor chip over the wiring board;   (c) after the step (b), forming a sealing body over the wiring board so as to cover the semiconductor chip;   (d) after the step (c), forming a product identification mark having a recessed shape and a peeling prevention mark having a recessed shape in a surface of the sealing body;   (e) after the step (d), cutting the sealing body using a first blade, and subjecting the wiring board to halfway dicing to expose the reference wiring line from a side surface of the wiring board;   (f) after the step (e), forming a shield film over the exposed side surface of the wiring board and the surface of the sealing body to electrically couple the shield film to the reference wiring line; and   (g) after the step (f), cutting the wiring board by dicing using a second blade thinner than the first blade.   
     
     
         2 . A method of manufacturing a semiconductor device according to  claim 1 ,
 wherein, in the step (d), the product identification mark and the peeling prevention mark are formed by irradiating the sealing body with laser light.   
     
     
         3 . A method of manufacturing a semiconductor device according to  claim 1 ,
 wherein, in the step (f), the shield film is formed by using an electroless plating method.   
     
     
         4 . A method of manufacturing a semiconductor device according to  claim 1 ,
 wherein, after the step (f) and prior to the step (g), a heat treatment step is present.   
     
     
         5 . A method of manufacturing a semiconductor device, comprising the steps of:
 (a) providing a wiring board in which a reference wiring line for supplying a reference potential is formed;   (b) after the step (a), mounting a semiconductor chip over the wiring board;   (c) after the step (b), forming a sealing body over the wiring board so as to cover the semiconductor chip;   (d) after the step (c), forming a product identification mark having a recessed shape in a surface of the sealing body;   (e) after the step (d), cutting the sealing body using a first blade, and halfway dicing the wiring board to expose the reference wiring line from a side surface of the wiring board;   (f) after the step (e), forming a shield film over the exposed side surface of the wiring board and the surface of the sealing body to electrically couple the shield film to the reference wiring line; and   (g) after the step (f), cutting the wiring board by dicing using a second blade thinner than the first blade,   wherein the step (c) includes the steps of:   (c1) sandwiching the wiring board over which the semiconductor chip is mounted between an upper mold die provided with a protruding portion and a lower mold die so as to dispose the semiconductor chip in a cavity formed between the upper mold die and the lower mold die; and   (c2) after the step (c1), injecting a resin into the cavity to form the sealing body covering the semiconductor chip, and   wherein the surface of the sealing body formed by the step   (c2) is formed with a peeling prevention mark having a recessed shape reflecting a shape of the protruding portion.   
     
     
         6 . A mobile telephone, comprising:
 (a) a baseband unit for processing a baseband signal;   (b) an RFIC unit for modulating the baseband signal processed in the baseband unit to a transmission signal;   (c) a power amplifier for amplifying a power of the transmission signal resulting from the modulation in the RFIC unit; and   (d) an antenna for transmitting the transmission signal amplified in the power amplifier,   wherein the RFIC unit further has a function of amplifying a reception signal received by the antenna, and demodulating the amplified reception signal,   wherein a power amplifying module including the power amplifier has:   (e1) a wiring board;   (e2) a semiconductor chip mounted over the wiring board;   (e3) a sealing body formed over the wiring board so as to cover the semiconductor chip; and   (e4) a shield film formed over a surface of the sealing body and electrically coupled to a reference wiring line formed in the wiring board to supply a reference potential, and   wherein the surface of the sealing body is formed with a product identification mark having a recessed shape for identification of a product and a peeling prevention mark having a recessed shape for preventing the shield film from peeling from the surface of the sealing body.