Light emitting devices for light emitting diodes (leds)

Abstract

Light emitting devices for light emitting diodes (LEDs) are disclosed. In one embodiment a light emitting device can include a submount and a light emission area disposed over the submount. The light emission area can include one or more light emitting diodes (LEDs), a fillet at least partially disposed about the one or more the LEDs, and filling material. The filling material can be disposed over a portion of the one or more LEDs and a portion of the fillet.

What is claimed is: 
     
         1 . A light emitting device, comprising:
 a submount;   a light emission area disposed over the submount, wherein the light emission area comprises at least one light emitting diode (LED);   a dispensed retention material at least partially disposed about the light emission area; and   a fillet at least partially disposed about the light emission area, wherein the fillet comprises a substantially vertical surface disposed against the retention material and the fillet comprises a substantially horizontal surface disposed above the submount.   
     
     
         2 . The light emitting device of  claim 1 , wherein a right angle is formed at an intersection of the substantially horizontal and the substantially vertical surfaces of the fillet, and the fillet comprises a curved upper surface. 
     
     
         3 . The light emitting device of  claim 2 , wherein the curved upper surface of the fillet is concave. 
     
     
         4 . The light emitting device of  claim 1 , wherein the substantially horizontal surface of the fillet is disposed against a reflection layer that is disposed in the submount. 
     
     
         5 . The light emitting device of  claim 1 , wherein the submount comprises a base material and a dielectric layer disposed over a portion of the base material. 
     
     
         6 . The light emitting device of  claim 5 , wherein the submount further comprises a copper (Cu) trace disposed over the dielectric layer. 
     
     
         7 . The light emitting device of  claim 6 , wherein the submount further comprises a layer of solder mask at least partially disposed over the Cu trace. 
     
     
         8 . The light emitting device of  claim 5 , wherein the submount further comprises at least one reflection layer disposed above the base material and below a portion of the dielectric layer. 
     
     
         9 . The light emitting device of  claim 8 , wherein the retention material is partially disposed against a portion of the at least one reflection layer. 
     
     
         10 . The light emitting device of  claim 8 , wherein the substantially horizontal surface of the fillet is disposed against the at least one reflection layer. 
     
     
         11 . The light emitting device of  claim 1 , further comprising a filling material disposed over a portion of the light emission area and the fillet. 
     
     
         12 . The light emitting device of  claim 1 , wherein the fillet and the at least one LED are each disposed along a planar surface of the submount.