US2015197840A1PendingUtilityA1
Systems and methods for removing overspray
Est. expiryJan 10, 2034(~7.5 yrs left)· nominal 20-yr term from priority
C23C 4/127C23C 4/18C23C 4/134
57
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Claims
Abstract
Systems and methods are disclosed for removing overspray from a substrate. A coating material may be plasma sprayed on a substrate utilizing Suspension Plasma Spray or Solution Precursor Plasma Spray. The plasma spray may deposit loosely adhered overspray on the substrate. A pressurized gas may be directed at the overspray to remove the overspray from the component.
Claims
exact text as granted — not AI-modified1 . A method of removing overspray comprising:
plasma spraying a substrate with a coating material, wherein the plasma spraying deposits an overspray on the substrate; and directing a separate pressurized gas at the overspray, wherein the pressurized gas carries a media.
2 . The method of claim 1 , wherein the pressurized gas removes the overspray from the substrate.
3 . The method of claim 1 , wherein the plasma spraying comprises at least one of a suspension plasma spray and a solution precursor plasma spray.
4 . The method of claim 1 , wherein the pressurized gas comprises at least one of carbon dioxide, nitrogen, argon, water vapor, and compressed air.
5 . The method of claim 1 , wherein the media comprises at least one of dry ice particles, water, liquid nitrogen, polymer beads, alumina powder, silicon carbide powder, glass beads, walnut shells, sodium bicarbonate, and sodium bicarbonate/alumina blend.
6 . The method of claim 1 , wherein the pressurized gas contacts the substrate with a kinetic energy sufficient to remove the overspray and insufficient to remove the coating material.
7 . The method of claim 1 , further comprising plasma spraying the substrate after directing the pressurized gas at the overspray.
8 . The method of claim 1 , further comprising determining a standoff distance between a gas nozzle and the substrate.
9 . The method of claim 1 , wherein the media at least one of sublimates and evaporates at standard temperature and pressure.
10 . The method of claim 1 , wherein the coating is deposited with a plasma torch, and wherein the pressurized gas is sprayed with a gas nozzle.
11 . The method of claim 10 , wherein the gas nozzle is coupled to the plasma torch.
12 . A system for coating a substrate comprising:
a plasma torch configured to deposit a coating material on a substrate; and a gas nozzle configured to remove overspray from the substrate.
13 . The system of claim 12 , further comprising a positioning control system coupled to the gas nozzle.
14 . The system of claim 12 , wherein the plasma torch is configured to utilize at least one of a suspension plasma spray and a solution precursor plasma spray.
15 . The system of claim 12 , further comprising a gas supply coupled to the gas nozzle.
16 . The system of claim 15 , wherein the gas supply comprises at least one of carbon dioxide, nitrogen, argon, water vapor, and compressed air.
17 . The system of claim 12 , wherein the gas nozzle is configured to direct dry ice particles at the substrate.
18 . The system of claim 12 , further comprising a control system, wherein the control system is configured to maintain a standoff distance between the gas nozzle and the substrate.
19 . The system of claim 12 , wherein the gas nozzle is one of a plurality of gas nozzles configured to remove overspray from the substrate.
20 . A method of plasma spraying a substrate comprising:
depositing a first plasma sprayed coating on a first portion of the substrate; depositing overspray on a second portion of the substrate; directing pressurized gas at the first portion of the substrate and at the second portion of the substrate, wherein the pressurized gas removes the overspray from the second portion of the substrate; and depositing a second plasma sprayed coating on the second portion of the substrate.Join the waitlist — get patent alerts
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