US2015187706A1PendingUtilityA1
Semiconductor Device Having Metal Lines with Slits
Assignee: CONVERSANT INTELLECTUAL PROPERTY MAN INCPriority: Feb 20, 2001Filed: Jan 8, 2015Published: Jul 2, 2015
Est. expiryFeb 20, 2021(expired)· nominal 20-yr term from priority
H10W 42/00H10W 20/43H10W 42/121H10D 88/01H10D 88/00H10D 84/038H01L 23/585H01L 23/562H01L 23/528H10B 41/20H10B 43/30H10B 10/12H10B 69/00H10B 10/125H10B 41/30H10B 10/15H10B 10/00
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Claims
Abstract
A semiconductor device including a semiconductor substrate, an integrated circuit on the semiconductor substrate, an insulation layer covering the integrated circuit, and a plurality of metal line patterns on the insulation layer. First and second adjacent metal line patterns of the plurality of metal line patterns are spaced apart from each other by a space, and each of the first and second adjacent metal line patterns has at least one slit.
Claims
exact text as granted — not AI-modifiedWhat is claimed is:
1 . A semiconductor device, comprising:
a semiconductor substrate; an integrated circuit on the semiconductor substrate; an insulation layer covering the integrated circuit; and a plurality of metal line patterns on the insulation layer, wherein first and second adjacent metal line patterns of the plurality of metal line patterns are spaced apart from each other by a space, and each of the first and second adjacent metal line patterns has at least one slit.Join the waitlist — get patent alerts
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