Plasma equipment for treating powder

Abstract

A powder plasma processing apparatus is disclosed. The powder plasma processing apparatus includes: a chamber configured to perform plasma processing on a powder; a powder supply unit disposed in an upper portion of the chamber; and a plurality of plate-like surface discharge plasma modules disposed below the powder supply unit and positioned within the chamber, wherein surfaces of the surface discharge plasma modules are spaced apart from each other. According to the powder plasma processing apparatus, the powder can be uniformly processed, and the time that the powder spends in contact with the plasma can be controlled, thereby allowing efficient powder processing to be performed.

1 - 12 . (canceled) 
     
     
         13 . A powder plasma processing apparatus comprising:
 a chamber configured to perform plasma processing on a powder; and   a plate-like surface discharge plasma module disposed in the chamber,   wherein the plate-like surface discharge comprises:
 an insulating layer; 
 a high-voltage-applying electrode which is disposed on the one side of the insulating layer and to which a high voltage is applied; and 
 a ground electrode which is disposed on the other side of the insulating layer, 
   wherein at least one of the high-voltage-applying electrode and the ground electrode is in the form of a bar, and are positioned in parallel with each other.   
     
     
         14 . The powder plasma processing apparatus of  claim 13 , wherein the apparatus comprises a powder supply unit disposed in an upper portion of the chamber, wherein the plate-like surface discharge plasma modules are disposed below the powder supply unit and positioned within the chamber, wherein the surfaces of the surface discharge plasma modules are not perpendicular to a direction in which the powder is supplied. 
     
     
         15 . The powder plasma processing apparatus of  claim 14 , further comprising an inclination adjusting unit configured to adjust an angle of inclination of the surface discharge plasma module to a predetermined angle within the chamber. 
     
     
         16 . The powder plasma processing apparatus of  claim 14 , wherein an upper portion of the surface discharge plasma module is positioned below the powder supply unit, a lower portion of the surface discharge plasma module is positioned in a direction inclined toward one side from the upper portion, and the powder supplied through the powder supply unit falls down in the inclined direction of the surface discharge plasma module inclined toward the one side. 
     
     
         17 . The powder plasma processing apparatus of  claim 13 , wherein the insulting layer surrounds the high-voltage-applying electrode or the ground electrode, and wherein the high-voltage-applying electrode or the ground electrode which is not surrounded by the insulting layer is in the form of bar and positioned in parallel with each other on one side of the insulting layer. 
     
     
         18 . The powder plasma processing apparatus of  claim 13 , wherein the insulting layer surrounds the high-voltage-applying electrode or the ground electrode, and wherein the high-voltage-applying electrode or the ground electrode which is not surrounded by the insulting layer is in the form of bar and positioned in parallel with each other on the both sides of the insulting layer. 
     
     
         19 . The powder plasma processing apparatus of  claim 14 , wherein the ground electrode is disposed in parallel with a direction in which the powder falls along the surface discharge plasma module to guide the powder to fall down. 
     
     
         20 . The powder plasma processing apparatus of  claim 13 , wherein the ground electrode and the high-voltage-applying electrode are in the form of a bar, and a cross-sectional shape of the surface discharge plasma module is such that the ground electrode and the high-voltage-applying electrode are alternately disposed on respective positions. 
     
     
         21 . The powder plasma processing apparatus of  claim 13 , wherein the ground electrode is in the form of a bar, and the high-voltage-applying electrode is in the form of a substrate. 
     
     
         22 . The powder plasma processing apparatus of  claim 13 , wherein the ground electrode is in the form of a substrate, and the high-voltage-applying electrode is in the form of a bar. 
     
     
         23 . The powder plasma processing apparatus of  claim 22 , wherein the same electrodes of the surface discharge plasma modules are disposed to face each other within the chamber.