US2015183564A1PendingUtilityA1
Simplified Reclosure Tray Lidding
Est. expiryDec 30, 2033(~7.4 yrs left)· nominal 20-yr term from priority
Inventors:Kevin O. Henderson
B65D 77/2096B65B 7/2878B32B 2307/414B32B 7/06B32B 2307/21B32B 2307/402B65D 77/2044B32B 2307/748B32B 27/283B32B 27/36B32B 27/18B32B 2307/746B32B 27/32B32B 27/30B32B 2307/7244B32B 2307/41B32B 7/12B32B 27/08B32B 2439/70B32B 2307/31B32B 2270/00
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Claims
Abstract
A resealable and disposable package assembly is described. The assembly includes a tray and a multilayer lid that are bonded to one another to initially seal the contents of the package. The package can then be easily opened by at least partially separating the lid and tray. The package can be reliably and effectively sealed by recontacting the previously separated portions to one another. Neither the lid nor the tray require die cutting.
Claims
exact text as granted — not AI-modifiedWhat is claimed is:
1 . A resealable package assembly, the package assembly including a lid and a tray, the lid comprising:
a polymeric substrate defining a sealing face; a heat seal layer; a release surface disposed between the sealing face of the substrate and the heat seal layer; and an adhesive layer disposed between the sealing face of the substrate and the heat seal layer; wherein the lid is free of structurally weakened provisions.
2 . The resealable package assembly of claim 1 wherein the adhesive layer includes a pressure sensitive adhesive.
3 . The resealable package assembly of claim 1 wherein an adhesive strength between the release surface and the adhesive layer is unequal to an adhesive strength between the adhesive layer and the heat seal layer.
4 . The resealable package assembly of claim 1 wherein the release surface is a release layer.
5 . The package assembly of claim 4 wherein the release layer includes silicone.
6 . The resealable package assembly of claim 1 wherein the lid further comprises:
at least one barrier layer.
7 . The resealable package assembly of claim 6 wherein the barrier layer exhibits an oxygen permeability of less than 50 cc/m 2 /24 hours.
8 . The resealable package assembly of claim 1 wherein the heat seal layer activates at a temperature within a range of from 60° C. to 164° C.
9 . The resealable package assembly of claim 1 wherein the heat seal layer forms a heat seal to the tray at 130° C. at 40 psig/1.5 seconds.
10 . The resealable package assembly of claim 1 wherein the structurally weakened provisions include a cut extending partially through a thickness of the lid.
11 . The resealable package assembly of claim 1 wherein after heat sealing of the lid to the tray, the package can be opened by separating at least a portion of the lid from the tray, the separating requiring an opening force of less than 15 N/inch.
12 . The resealable package assembly of claim 1 wherein the lid is sealingly engaged to the tray.
13 . The resealable package assembly of claim 12 wherein the lid is heat sealed to the tray.
14 . The resealable package assembly of claim 1 wherein at least a portion of the lid is separated from the tray by separating the adhesive layer of the lid from the release layer of the lid.
15 . The resealable package assembly of claim 1 wherein the release layer is disposed on the sealing face of the substrate adjacent to and in contact with the adhesive layer.
16 . The resealable package assembly of claim 15 wherein the heat seal layer is adjacent to and in contact with the adhesive layer.
17 . The resealable package assembly of claim 1 wherein the adhesive layer is disposed on the sealing face of the substrate adjacent to and in contact with the release layer.
18 . The resealable package assembly of claim 17 wherein the heat seal layer is adjacent to and in contact with the release layer.
19 . A method for opening and resealing a previously heat sealed package, the package including a lid and a tray, the lid having a polymeric substrate defining a sealing face, a heat seal layer, a release surface disposed between the sealing face of the substrate and the heat seal layer, and an adhesive layer disposed between the sealing face of the substrate and the heat seal layer, the lid being free of structurally weakened provisions, the lid and the tray being heat sealed to one another, the method comprising:
separating at least a portion of the lid from the tray within a heat seal region by separating the adhesive layer from the release surface in the heat seal region to thereby open the package; and matingly contacting the adhesive layer with the release surface within the heat seal region to thereby reseal the package.
20 . The method of claim 19 wherein the adhesive is a pressure sensitive adhesive.
21 . The method of claim 19 wherein the lid and the tray are heat sealed to one another by:
contacting the heat seal layer of the lid with the tray in the heat seal region; and
heating at least one of the lid and the tray within the heat seal region to a temperature of from about 60° C. to 164° C.
22 . The method of claim 21 wherein heating is performed at a temperature of 130° C.
23 . The method of claim 21 wherein the lid and the tray are heat sealed to one another by also:
applying pressure to the lid and the tray during the heating.
24 . The method of claim 23 wherein the lid and the tray are heat sealed to one another by heating to 130° C. and applying 40 psig pressure.
25 . The method of claim 19 wherein separating requires an opening force of less than 15 N/inch.
26 . The resealable package assembly of claim 1 wherein the release surface is the sealing face of the substrate.
27 . The resealable package assembly of claim 26 wherein the lid further comprises:
at least one barrier layer.
28 . The resealable package assembly of claim 27 wherein the barrier layer exhibits an oxygen permeability of less than 50 cc/m 2 /24 hours.
29 . The resealable package assembly of claim 26 wherein the heat seal layer activates at a temperature within a range of from 60° C. to 164° C.
30 . The resealable package assembly of claim 26 wherein the heat seal layer forms a heat seal to the tray at 130° C. at 40 psig/1.5 seconds.
31 . The resealable package assembly of claim 26 wherein the structurally weakened provisions include a cut extending partially through a thickness of the lid.
32 . The resealable package assembly of claim 26 wherein the adhesive layer is disposed on the sealing face of the substrate adjacent to and in contact with the heat seal layer.
33 . The resealable package assembly of claim 26 wherein after heat sealing of the lid to the tray, the package can be opened by separating at least a portion of the lid from the tray, the separating requiring an opening force of less than 15 N/inch.
34 . The resealable package assembly of claim 26 wherein the lid is sealingly engaged to the tray.
35 . The resealable package assembly of claim 34 wherein the lid is heat sealed to the tray.
36 . The resealable package assembly of claim 26 wherein the adhesive strength between the sealing face of the substrate and the adhesive layer is less than the adhesive strength between the adhesive layer and the heat seal layer.
37 . The resealable package assembly of claim 36 wherein at least a portion of the lid is separated from the tray by separating the adhesive layer of the lid from the sealing face of the substrate.
38 . The resealable package assembly of claim 26 wherein the adhesive strength between the sealing face of the substrate and the adhesive layer is greater than the adhesive strength between the adhesive layer and the heat seal layer.
39 . The resealable package assembly of claim 38 wherein at least a portion of the lid is separated from the tray by separating the adhesive layer of the lid from the heat seal layer.Join the waitlist — get patent alerts
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