Methods and apparatus toward preventing esc bonding adhesive erosion

Abstract

Embodiments of the present invention provide chamber components having a protective element for shielding bonding material from processing environments in a processing environment. The protective element may include protective seals, protective structures, erosion resistive filers, or combinations thereof. Embodiments of the present invention reduce erosion of bonding material used in a processing chamber, thus, improving processing quality and reducing maintenance costs.

What is claimed is: 
     
         1 . An apparatus use in a processing chamber, comprising:
 a first component having a first surface;   a second component having a second surface, wherein the second surface faces the first surface of the first component;   a bonding material disposed between the first surface and the second surface and joining the first component and the second component; and   a protective element disposed for preventing the bonding material from erosion in the processing chamber, wherein the protective element comprising a silicon filler disposed in the bonding material.   
     
     
         2 . The apparatus of  claim 1 , further comprising a protective sea surrounding the bonding material. 
     
     
         3 . The apparatus of  claim 2 , wherein the protective seal is disposed in a recess formed at an interface between the first component and the second component. 
     
     
         4 . The apparatus of  claim 3 , wherein the recess is defined by a step formed in an outer region of the first component, and the step facing the second component. 
     
     
         5 . The apparatus of  claim 3 , wherein the recess is defined by a first step formed in an outer region of the first component and a second step formed in an outer region of the second component. 
     
     
         6 . An apparatus for use in a processing chamber, comprising:
 a first component having a first surface;   a second component having a second surface, wherein the second surface faces the first surface of the first component;   a bonding material disposed between the first surface and the second surface and joining the first component and the second component;   a protective structure extending from the first surface if the first component covering the bonding material, the protective structure integral with the first component.   
     
     
         7 . The apparatus of  claim 6 , wherein the protective structure comprises a continuous Up extending from the first component and overlapping an interface between the first component and the second component in which the bonding material is disposed. 
     
     
         8 . The apparatus of claim wherein the protective structure further comprises a groove formed in the second component for receiving the continuous lip.