Sharing resources in multi-dice stacks

Abstract

Apparatus, systems, and methods for configuring a plurality of stacked semiconductor dice with unique identifiers and identifying a die in the stack using the unique identifier are provided. Additional apparatus and methods are disclosed.

What is claimed is: 
     
         1 . A method comprising:
 configuring a die of a plurality of stacked semiconductor dice to associate the die with a unique identifier;   identifying the die as an identified die using the unique identifier; and   making ownership of a first action request by the identified die observable to other dice of the plurality of stacked semiconductor dice, wherein one die of the other dice is configured, while the identified die is driving a resource shared by the plurality of stacked semiconductor dice, to decode a non-matching identification number that is associated with the first action request and not associated with the one die of the other dice to disable access by the one die of the other dice to the resource, to receive a second action request, and to decode a matching identification number associated with the second action request.   
     
     
         2 . The method of  claim 1 , wherein the first action request includes at least one of a control or timing signal, and wherein each die of the plurality of stacked semiconductor dice includes snoop logic to monitor and determine when the identified die stops driving the resource. 
     
     
         3 . The method of  claim 2 , wherein a transmission of the second action request associated with the one die of the other dice is delayed by the snoop logic of the die of the other dice until the first action request issued to the identified die is complete. 
     
     
         4 . The method of  claim 1 , wherein configuring the die includes storing the unique identifier in the die. 
     
     
         5 . The method of  claim 1 , wherein configuring the die with the unique identifier includes using a first die next to the die to enable the configuration. 
     
     
         6 . The method of  claim 1 , wherein configuring the die occurs when the stacked semiconductor dice are powered up or reset. 
     
     
         7 . The method of  claim 1 , further including sharing a bus by the plurality of stacked semiconductor dice, the bus including at least one of a control bus, an address bus, or a data bus. 
     
     
         8 . The method of  claim 7 , wherein identifying the die includes identifying the die using an identification number when placing a signal destined for the die on the bus. 
     
     
         9 . An apparatus comprising:
 a plurality of stacked semiconductor dice;   a configuration module to configure a die of the plurality of stacked semiconductor dice with a unique identifier to associate the die with the unique identifier;   an identification module to identify the die as an identified die using the unique identifier; and   a snoop module to make ownership of a first action request by the identified die observable to other dice of the plurality of stacked semiconductor dice,   wherein one die of the other dice is configured, while the identified die is driving a resource shared by the plurality of stacked semiconductor dice, to decode a non-matching identification number that is associated with the first action request and not associated with the one die of the other dice to disable access by the one die of the other dice to the resource, to receive a second action request, and to decode a matching identification number associated with the second action request.   
     
     
         10 . The apparatus of  claim 9 , including a bus shared by the plurality of stacked semiconductor dice, the bus including at least one of a control bus, an address bus, or a data bus. 
     
     
         11 . The apparatus of  claim 10 , wherein the die includes a driver to transmit signals to the bus when the die is identified as an owner of the bus. 
     
     
         12 . The apparatus of  claim 10 , wherein the die includes a receiver to receive signals from the bus, the receiver being enabled when another die is driving the bus. 
     
     
         13 . The apparatus of  claim 9 , further including a register to store the unique identifier in the die. 
     
     
         14 . The apparatus of  claim 9 , wherein the configuration module is arranged to configure the die when the stack is powered up or reset. 
     
     
         15 . The apparatus of  claim 9 , wherein the identification module includes an interface to identify the die by applying another identification number to inputs at an input/output (I/O) interface of the die. 
     
     
         16 . The apparatus of  claim 9 , wherein the identification module includes a decoder to decode a received identification number to generate a set of select signals, the set of select signals causing selection of the die. 
     
     
         17 . The apparatus of  claim 16 , wherein the identification module is arranged to compare the received identification number with a stored unique identifier to identify the die as the identified die. 
     
     
         18 . The apparatus of  claim 9 , wherein the die comprises a memory chip including a dynamic random access memory (DRAM), and wherein the DRAM includes a plurality of partitions and the plurality of partitions share the unique identifier. 
     
     
         19 . A stack comprising:
 means for configuring a die of a plurality of stacked semiconductor dice with a unique identifier to provide an identified die; and   means for making an ownership of a first action request by the identified die observable to other dice of the plurality of stacked semiconductor dice, wherein one die of the other dice is configured, while the identified die is driving a resource shared by the plurality of stacked semiconductor dice, to decode a non-matching identification number that is associated with the first action request and not associated with the one die of the other dice to disable access by the one die of the other dice to the resource, to receive a second action request, and to decode a matching identification number associated with the second action request.   
     
     
         20 . The stack of  claim 19 , wherein the one die of the other dice is configured, while the identified die is driving the resource, to observe the first action request issued to the identified die.