Motor-driven compressor

Abstract

There is provided a motor-driven compressor including a semiconductor device that comprises a compression mechanism, a motor, a housing, a wall, an electronic component, and a resin member. The motor drives the compression mechanism. The housing accommodates therein the compression mechanism and the motor. The wall extends from an outer surface of the housing so as to surround a part thereof and have an opened end and cooperates with the outer surface of the housing to form a casing. The electronic component is accommodated in the casing and includes a semiconductor module that includes a circuit board connected to the outer surface of the housing and a semiconductor element mounted to the circuit board. The resin member seals an entirety of the electronic component in the casing.

What is claimed is: 
     
         1 . A motor-driven compressor including a semiconductor device, comprising:
 a compression mechanism;   a motor driving the compression mechanism;   a housing accommodating therein the compression mechanism and the motor;   a wall extending from an outer surface of the housing so as to surround a part thereof and have an opened end, the wall cooperating with the outer surface of the housing to form a casing;   an electronic component accommodated in the casing and including a semiconductor module, the semiconductor module including a circuit board connected to the outer surface of the housing and a semiconductor element mounted to the circuit board; and   a resin member sealing an entirety of the electronic component in the casing.   
     
     
         2 . The motor-driven compressor according to  claim 1 , wherein the circuit board has a stress reducing part for reducing stress of a connection between the circuit board and the semiconductor element and a connection between the circuit board and the housing. 
     
     
         3 . The motor-driven compressor according to  claim 1 , wherein the circuit board is brazed to the housing.