Plating apparatus, plating method, and storage medium

Abstract

A plating method can improve uniformity in thickness of a plating layer formed on an inner surface of a recess. The plating method includes a loading process of loading the substrate in which the recess is formed into a casing; and a plating process of supplying a plating liquid to the substrate and forming a plating layer having a specific function on an inner surface of the recess. In the plating process, after supplying the plating liquid to the substrate and filling the plating liquid into the recess, a plating liquid having a higher temperature than a temperature of the plating liquid is supplied to the substrate.

1 . A plating method of performing a plating process to a recess formed in a substrate, the plating method comprising:
 a loading process of loading the substrate in which the recess is formed into a casing; and   a plating process of supplying a plating liquid to the substrate and forming a plating layer having a specific function on an inner surface of the recess,   wherein, in the plating process, after supplying the plating liquid to the substrate and filling the plating liquid into the recess, a plating liquid having a higher temperature than a temperature of the plating liquid is supplied to the substrate.   
     
     
         2 . The plating method of  claim 1 , further comprising:
 a pre-treatment process of supplying a pre-treatment liquid to the substrate,   wherein the plating process includes a substation process of supplying the plating liquid to the substrate and substituting the pre-treatment liquid filled into the recess in the substrate with the plating liquid, and a film forming process of forming the plating layer by supplying the plating liquid to the substrate after the substitution process, and   a temperature of the plating liquid used in the substitution process is set to be lower than a temperature of the plating liquid used in the film forming process.   
     
     
         3 . The plating method of  claim 2 ,
 wherein the film forming process includes a process of supplying a plating liquid heated to a temperature higher than the temperature of the plating liquid used in the substitution process to the substrate.   
     
     
         4 . The plating method of  claim 2 ,
 wherein the film forming process includes a process of heating the plating liquid supplied to the substrate to a temperature higher than the temperature of the plating liquid used in the substitution process.   
     
     
         5 . The plating method of  claim 2 ,
 wherein the pre-treatment liquid is formed of deionized water on which a deaeration process is performed.   
     
     
         6 . The plating method of  claim 5 , further comprising:
 a pre-wet process of supplying ionized water containing ions to the substrate before the pre-treatment process.   
     
     
         7 . The plating method of  claim 2 ,
 wherein, in the film forming process, the plating liquid is discharged from multiple discharge nozzles arranged in parallel with each other along a radial direction of the substrate or discharged from a discharge nozzle extended along the radial direction of the substrate.   
     
     
         8 . A plating apparatus of performing a plating process to
 a recess formed in a substrate, the plating apparatus comprising:   a substrate holding unit configured to hold the substrate in which the recess is formed; and   a plating unit configured to supply a plating liquid to the substrate and form a plating layer having a specific function on an inner surface of the recess,   wherein, after supplying the plating liquid to the substrate and filling the plating liquid into the recess, the plating unit is configured to supply a plating liquid having a higher temperature than a temperature of the plating liquid.   
     
     
         9 . The plating apparatus of  claim 8 , further comprising:
 a pre-treatment unit configured to supply a pre-treatment liquid to the substrate,   wherein the plating unit includes a substitution unit configured to supply the plating liquid for substituting the pre-treatment liquid filled into the recess in the substrate to the substrate, and a film forming unit configured to supply the plating liquid to the substrate after the substitution unit supplies the plating liquid to the substrate, and   a temperature of the plating liquid used in the substitution unit is set to be lower than a temperature of the plating liquid used in the film forming unit.   
     
     
         10 . The plating apparatus of  claim 9 ,
 wherein the film forming unit is configured to supply a plating liquid heated to a temperature higher than the temperature of the plating liquid used in the substitution unit to the substrate.   
     
     
         11 . The plating apparatus of  claim 9 ,
 wherein the film forming unit is configured to heat the plating liquid supplied to the substrate to a temperature higher than the temperature of the plating liquid used in the substitution unit.   
     
     
         12 . The plating apparatus of  claim 9 ,
 wherein the pre-treatment liquid is formed of deionized water on which a deaeration process is performed.   
     
     
         13 . The plating apparatus of  claim 12 , further comprising:
 a pre-wet unit configured to supply ionized water containing ions to the substrate before supplying the pre-treatment liquid to the substrate.   
     
     
         14 . The plating apparatus of  claim 9 ,
 wherein the film forming unit includes multiple discharge nozzles arranged in parallel with each other along a radial direction of the substrate and configured to discharge the plating liquid to the substrate, or a discharge nozzle extended along the radial direction of the substrate and configured to discharge the plating liquid to the substrate.   
     
     
         15 . A computer-readable storage medium having stored thereon computer-executable instructions that, in response to execution, cause a plating apparatus to perform a plating method of performing a plating process to a recess formed in a substrate,
 wherein the plating method comprises:   a loading process of loading the substrate in which the recess is formed into a casing; and   a plating process of supplying a plating liquid to the substrate and forming a plating layer having a specific function on an inner surface of the recess,   wherein, in the plating process, after supplying the plating liquid to the substrate and filling the plating liquid into the recess, a plating liquid having a higher temperature than a temperature of the plating liquid is supplied to the substrate.