Display Device and Manufacturing Method Thereof

Abstract

In a display device using an organic light emitting diode (OLED), the occurrence of a dark spot and peeling of a cathode due to moisture are suppressed. An outer edge portion of a sealing substrate (second substrate) ( 102 ) is made to have a convex shape and a gap between the sealing substrate and an element substrate are controlled by means of this convex region. Thus, since it is not required that a layer ( 106 ) having adhesion for bonding together the sealing substrate and the element substrate has a function for controlling the gap, the thickness of the layer can be minimized. Therefore, the amount of moisture which is transmitted through the layer (having adhesion) made of an organic material and penetrated in a sealed region can be reduced.

1 . (canceled) 
     
     
         2 . A light emitting device comprising:
 a first substrate;   a light emitting element comprising a light emitting layer comprising an organic compound over the first substrate; and   a second substrate over the light emitting element, the second substrate bonded to the first substrate through a layer having adhesion,   wherein the second substrate comprises a first region overlapped with the layer having adhesion and a second region overlapped with the light emitting element,   wherein each of the first region and the second region comprises minute unevennesses on a bottom surface of the second substrate, and   wherein the minute unevennesses in the first region are in contact with the layer having adhesion.   
     
     
         3 . The light emitting device according to  claim 2 , wherein each of the first substrate and the second substrate is a glass substrate. 
     
     
         4 . The light emitting device according to  claim 2 , wherein heights of the minute unevennesses in the first region are set to be 0.1 μm to 3 μm. 
     
     
         5 . The light emitting device according to  claim 2 , wherein the layer having adhesion comprises an ultraviolet light curable resin or a heat curable resin. 
     
     
         6 . The light emitting device according to  claim 2 , wherein a thickness of the layer having adhesion is 10 μm or less. 
     
     
         7 . The light emitting device according to  claim 2 ,
 wherein light emitted from the light emitting element enters the second substrate from the bottom surface of the second substrate, and   wherein the light emitted from the light emitting element is released from a top surface of the second substrate through the second region.   
     
     
         8 . An electronic appliance comprising a display device comprising the light emitting device according to  claim 2  in a display portion. 
     
     
         9 . A light emitting device comprising:
 a first substrate;   a light emitting element comprising a light emitting layer comprising an organic compound over the first substrate; and   a second substrate over the light emitting element, the second substrate bonded to the first substrate through a layer having adhesion,   wherein the second substrate comprises a first region overlapped with the layer having adhesion, a second region overlapped with the light emitting element, and a third region overlapped with a driver circuit,   wherein each of the first region, the second region, and the third region comprises minute unevennesses on a bottom surface of the second substrate,   wherein a dry agent is provided in the third region, and   wherein the minute unevennesses in the first region are in contact with the layer having adhesion.   
     
     
         10 . The light emitting device according to  claim 9 , wherein each of the first substrate and the second substrate is a glass substrate. 
     
     
         11 . The light emitting device according to  claim 9 , wherein heights of the minute unevennesses in the first region are set to be 0.1 μm to 3 μm. 
     
     
         12 . The light emitting device according to  claim 9 , wherein the layer having adhesion comprises an ultraviolet light curable resin or a heat curable resin. 
     
     
         13 . The light emitting device according to  claim 9 , wherein a thickness of the layer having adhesion is 10 μm or less. 
     
     
         14 . The light emitting device according to  claim 9 ,
 wherein light emitted from the light emitting element enters the second substrate from the bottom surface of the second substrate, and   wherein the light emitted from the light emitting element is released from a top surface of the second substrate through the second region.   
     
     
         15 . An electronic appliance comprising a display device comprising the light emitting device according to  claim 9  in a display portion. 
     
     
         16 . A light emitting device comprising:
 a first substrate;   a light emitting element comprising a light emitting layer comprising an organic compound over the first substrate; and   a second substrate over the light emitting element, the second substrate bonded to the first substrate through a layer having adhesion,   wherein the second substrate comprises a first region overlapped with the layer having adhesion and a second region overlapped with the light emitting element,   wherein the first region comprises minute unevennesses on a bottom surface of the second substrate, and   wherein the minute unevennesses in the first region are in contact with the layer having adhesion.   
     
     
         17 . The light emitting device according to  claim 16 , wherein each of the first substrate and the second substrate is a glass substrate. 
     
     
         18 . The light emitting device according to  claim 16 , wherein heights of the minute unevennesses in the first region are set to be 0.1 μm to 3 μm. 
     
     
         19 . The light emitting device according to  claim 16 , wherein the layer having adhesion comprises an ultraviolet light curable resin or a heat curable resin. 
     
     
         20 . The light emitting device according to  claim 16 , wherein a thickness of the layer having adhesion is 10 μm or less. 
     
     
         21 . The light emitting device according to  claim 16 ,
 wherein light emitted from the light emitting element enters the second substrate from the bottom surface of the second substrate, and   wherein the light emitted from the light emitting element is released from a top surface of the second substrate through the second region.   
     
     
         22 . An electronic appliance comprising a display device comprising the light emitting device according to  claim 16  in a display portion.