Soldering a semiconductor device and a substrate based on oscillating frequencies

Abstract

A method includes applying solder to conductive pads of a semiconductor device, applying solder to conductive pads of a substrate, aligning the solder on the semiconductor device with the solder on the substrate such that portions of the solder on the semiconductor device contact corresponding portions of the solder on the substrate, heating the semiconductor device and the substrate to liquefy the solder, and exerting an oscillating force operative to oscillate the semiconductor device relative to the substrate at a frequency.

What is claimed is: 
     
         1 . A system comprising:
 a heating device operative to heat a semiconductor device and substrate to a melting point temperature for a solder material formed on the semiconductor device and the substrate; and   a vibration device operative to induce an oscillating relative motion between the semiconductor device and the substrate at a frequency while the semiconductor device and the substrate are disposed in the heating device.   
     
     
         2 . The system of  claim 1 , wherein the heating device includes an oven. 
     
     
         3 . The system of  claim 1 , wherein the vibration device includes a piezoelectric device. 
     
     
         4 . The system of  claim 1 , wherein the vibration device includes a sonic device. 
     
     
         5 . The system of  claim 1 , wherein the vibration device includes a radiation emitting device. 
     
     
         6 . The system of  claim 1 , wherein the vibration device is operative to impart a force on the substrate. 
     
     
         7 . The system of  claim 1 , wherein the vibration device is operative to impart a force on the semiconductor device. 
     
     
         8 . The system of  claim 7 , wherein the force exerted on the semiconductor device includes an oscillation force over a band of frequencies estimated based on a number of solder portions of the solder material and the mass of the semiconductor device. 
     
     
         9 . The system of  claim 1 , wherein the frequency is based on a number of solder portions of the solder material and a mass of the semiconductor device. 
     
     
         10 . The system of  claim 9 , wherein the frequency is based on a spring constant of the solder portions arranged on the conductive pads of the substrate that have liquefied and divided by the mass of the semiconductor device. 
     
     
         11 . The system of  claim 10 , wherein the frequency is estimated to be a resonance frequency over a frequency band of 900 Hz to 950 Hz. 
     
     
         12 . The system of  claim 1 , wherein the frequency is an estimated resonance frequency of the motion of the semiconductor device relative to the substrate.