Flow path member, and heat exchanger and semiconductor manufacturing device using same

Abstract

There is provided a flow path member including: a first wall section; a second wall section; and a third wall section that is provided between the first wall section and the second wall section. An internal section that is configured by the first wall section, the second wall section, and the third wall section becomes a flow path through which a fluid flows and a plurality of flow path openings of the flow path are arranged in one direction on a cut plane obtained by cutting from the first wall section to the second wall section. Furthermore, one of two adjacent flow path openings is disposed to be more displaced than the other either toward the first wall section side or toward the second wall section side.

1 . A flow path member comprising:
 a first wall section;   a second wall section; and   a third wall section that is provided between the first wall section and the second wall section,   wherein an internal section that is configured by the first wall section, the second wall section, and the third wall section becomes a flow path through which a fluid flows and a plurality of flow path openings of the flow path are arranged in one direction on a cut plane obtained by cutting from the first wall section to the second wall section, and   wherein one of two adjacent flow path openings is disposed to be more displaced than the other either toward the first wall section side or toward the second wall section side.   
     
     
         2 . The flow path member according to  claim 1 ,
 wherein, among all of the plurality of flow path openings on the cut plane, one of two adjacent flow path openings is disposed to be more displaced than the other either toward the first wall section side or toward the second wall section side.   
     
     
         3 . The flow path member according to  claim 1 ,
 wherein the central portion of at least one of the first wall section and the second wall section that configures the flow path is curved toward the flow path side.   
     
     
         4 . The flow path member according to  claim 1 ,
 wherein the flow path openings are disposed to be displaced gradually closer either to the first wall section side or to the second wall section side approaching the center than at the opposite ends when all of the plurality of flow path openings on the cut plane are viewed.   
     
     
         5 . The flow path member according to  claim 1 ,
 wherein the flow path openings are disposed to be displaced toward the first wall section side or toward the second wall section side alternately when all of the plurality of flow path openings on the cut plane are viewed.   
     
     
         6 . A heat exchanger comprising:
 a metal member that is provided on at least one surface or in at least one interior section of the first wall section and the second wall section of the flow path member according to  claim 1 .   
     
     
         7 . A semiconductor manufacturing device comprising:
 a heat exchanger in which a metal member is provided in at least one interior section of the first wall section and the second wall section of the flow path member according to  claim 1  and the metal member is an electrode for adsorbing a wafer.