Liquid compression modling encapsulants

Abstract

Thermosetting resin compositions useful for liquid compression molding encapsulation of a reconfigured wafer are provided. The so-encapsulated molded wafer offers improved resistance to warpage, compared to reconfigured wafers encapsulated with known encapsulation materials.

What is claimed is: 
     
         1 . A thermosetting resin composition, comprising a thermosetting resin matrix, a block copolymer, a silica filler and a cure component comprising the combination of an anhydride or a phenolic resin and an imidizole. 
     
     
         2 . The composition of  claim 1 , wherein when cured the composition exhibits a modulus in the range of about 22 GPas or less at room temperature, a CTE al of less than or equal to 10 ppm, and multiple Tgs. 
     
     
         3 . The composition of  claim 2 , wherein the multiple Tgs include a T g1  of about −70° C. to −30° C. and a T g2  of about 100° C. to 150° C. 
     
     
         4 . A method of improving warpage resistance of a mold wafer encapsulated by a composition according to  claim 1 , steps of which comprise:
 providing a reconfigured wafer;   providing a thermosetting resin composition according to  claim 1  in contact with the wafer; and   exposing the wafer and the thermosetting resin composition to conditions favorable to allow the thermosetting resin composition to flow about the wafer and cure to reaction product of the thermosetting resin composition which is capable of improving warpage resistance by about 20% to 65%.   
     
     
         5 . A product formed from the method of  claim 4 . 
     
     
         6 . The composition of  claim 1  wherein the thermosetting resin component comprises an epoxy resin component, an episulfide resin component, an oxazine component, an oxazoline component, a cyanate ester component, and/or a maleimide-, a nadimide- or an itaconimide-containing component. 
     
     
         7 . The composition of  claim 1 , wherein the block copolymer is amphiphilic.