Method and tool for producing a surface of predetermined roughness

Abstract

For producing a cylindrical surface that has a surface structure of predetermined geometry suitable for application of material by thermal spraying, a geometrically predetermined groove structure of minimal depth and width is introduced into the surface by a tool embodied as a follow-on tool in that a groove cross-section is processed successively to a final size. In order for the surface to be producible in mass production with constant quality, the groove structure is worked in such that first a base groove is introduced with a groove bottom width that is smaller than the groove bottom width of the finished groove. Subsequently, at least one flank of the base groove is processed for producing an undercut groove profile by a non-cutting action or cutting action wherein the introduced groove structure is deformed in such a way that the groove openings are constricted by upsetting deformations of material.

1 - 25 . (canceled) 
     
     
         26 . A method for roughening a surface of a substrate, the method comprising:
 forming at least a first groove in the surface of the substrate by contacting the surface of the substrate with a first tooth, the first groove having a first groove shape, the first tooth having a first tooth shape; and   contacting the substrate with a second tooth to change the shape of the first groove to a second groove shape, the second groove shape different from the first groove shape, the second tooth having a second tooth shape, the second tooth shape different from the first tooth shape.   
     
     
         27 . A method as recited in  claim 26 , wherein the first tooth is a cutting tooth, and said forming at least a first groove in the surface of the substrate comprises removing material from the substrate. 
     
     
         28 . A method as recited in  claim 26 , wherein said forming at least a first groove in the surface of the substrate comprises pressing the first tooth into the surface of the substrate. 
     
     
         29 . A method as recited in  claim 26 , wherein said contacting the substrate with the second tooth comprises deforming the first groove. 
     
     
         30 . A method as recited in  claim 26 , wherein said contacting the substrate with the second tooth comprises removing material from the substrate. 
     
     
         31 . A method as recited in  claim 26 , wherein the surface of the substrate is substantially cylindrical. 
     
     
         32 . A method as recited in  claim 26 , wherein the surface of the substrate comprises a plurality of regions, at least some of which substantially coincide with a cylindrical shape. 
     
     
         33 . A method as recited in  claim 26 , wherein the first tooth and the second tooth are both part of a first cutting plate. 
     
     
         34 . A method as recited in  claim 26 , wherein the method further comprises:
 rotating at least one of the substrate surface, the first tooth and the second tooth such that the surface of the substrate rotates, relative to the first tooth and the second tooth, about a first axis, and   moving at least one of the substrate surface, the first tooth and the second tooth such that the substrate surface moves, relative to the first tooth and the second tooth, along the first axis.   
     
     
         35 . A method as recited in  claim 34 , wherein the surface of the substrate is substantially cylindrical and the first groove is substantially helical. 
     
     
         36 . A method as recited in  claim 26 , wherein:
 the first tooth and the second tooth are both part of a first cutting plate,   the first cutting plate further comprises at least a third tooth,   the method further comprises contacting the substrate with the third tooth.   
     
     
         37 . A method as recited in  claim 36 , wherein the first cutting plate further comprises at least a fourth tooth, a fifth tooth, a sixth tooth, a seventh tooth, an eighth tooth, a ninth tooth and a tenth tooth. 
     
     
         38 . A method as recited in  claim 26 , wherein the first tooth and the second tooth are both integral with a first cutting plate. 
     
     
         39 . A method for roughening a surface of a substrate, the method comprising:
 forming at least a first groove in the surface of the substrate, the first groove having a first depth relative to the surface of the substrate, and   increasing the depth of the first groove to a second depth relative to the surface of the substrate, the second depth greater than the first depth.   
     
     
         40 . A method as recited in  claim 39 , wherein the method further comprises contacting the substrate with a displacement structure. 
     
     
         41 . A method as recited in  claim 39 , wherein:
 said forming at least a first groove in the surface of the substrate comprises contacting the substrate with a first tooth, and   said increasing the depth of the first groove comprises contacting the first groove with a second tooth.   
     
     
         42 . A method as recited in  claim 39 , wherein the first tooth is a cutting tooth, and said forming at least a first groove in the surface of the substrate comprises removing material from the substrate. 
     
     
         43 . A method as recited in  claim 39 , wherein said forming at least a first groove in the surface of the substrate comprises pressing the first tooth into the surface of the substrate. 
     
     
         44 . A method as recited in  claim 39 , wherein said increasing the depth of the first groove comprises deforming the first groove. 
     
     
         45 . A method as recited in  claim 39 , wherein said increasing the depth of the first groove comprises removing material from the substrate. 
     
     
         46 . A method as recited in  claim 39 , wherein the surface of the substrate is substantially cylindrical. 
     
     
         47 . A method as recited in  claim 39 , wherein the surface of the substrate comprises a plurality of regions, at least some of which substantially coincide with a cylindrical shape. 
     
     
         48 . A method as recited in  claim 39 , wherein the first tooth and the second tooth are both part of a first cutting plate. 
     
     
         49 . A method as recited in  claim 48 , wherein the first tooth and the second tooth are both integral with the first cutting plate. 
     
     
         50 . A method as recited in  claim 39 , wherein the method further comprises:
 rotating at least one of the substrate surface, the first tooth and the second tooth such that the surface of the substrate rotates, relative to the first tooth and the second tooth, about a first axis, and   moving at least one of the substrate surface, the first tooth and the second tooth such that the substrate surface moves, relative to the first tooth and the second tooth, along the first axis.   
     
     
         51 . A method as recited in  claim 50 , wherein:
 the method further comprises contacting the substrate with at least a first displacement structure.   
     
     
         52 . A method as recited in  claim 51 , wherein:
 the first tooth is spaced from the second tooth by a first pitch, and   the first displacement structure is spaced from the tooth by a distance that (1) differs from the first pitch and (2) differs from any multiple of the first pitch.   
     
     
         53 . A method as recited in  claim 50 , wherein the surface of the substrate is substantially cylindrical and the first groove is substantially helical. 
     
     
         54 . A method as recited in  claim 39 , wherein:
 the first tooth and the second tooth are both part of a first cutting plate,   the first cutting plate further comprises at least a third tooth,   the method further comprises contacting the substrate with the third tooth.   
     
     
         55 . A method as recited in  claim 44 , wherein the first cutting plate further comprises at least a fourth tooth, a fifth tooth, a sixth tooth, a seventh tooth, an eighth tooth, a ninth tooth and a tenth tooth. 
     
     
         56 . A method for roughening a surface of a substrate, the method comprising:
 forming at least a first groove in the surface of the substrate by contacting the substrate with a first tooth, the first groove having a first groove maximum width, the first tooth having a first tooth maximum width; and   contacting the first groove with a second tooth to increase the maximum width of the first groove to a second groove maximum width, the second tooth having a second tooth maximum width, the second tooth maximum width greater than the first tooth maximum width.   
     
     
         57 . A method as recited in  claim 56 , wherein:
 the first tooth has a substantially uniform width; and   the second tooth is tapered, and has a maximum width at a maximum projecting location.   
     
     
         58 . A method as recited in  claim 56 , wherein the first tooth is a cutting tooth, and said forming at least a first groove in the surface of the substrate comprises removing material from the substrate. 
     
     
         59 . A method as recited in  claim 56 , wherein said forming at least a first groove in the surface of the substrate comprises pressing the first tooth into the surface of the substrate. 
     
     
         60 . A method as recited in  claim 56 , wherein said contacting the first groove with the second tooth comprises deforming the first groove. 
     
     
         61 . A method as recited in  claim 56 , wherein said contacting the first groove with the second tooth comprises removing material from the substrate. 
     
     
         62 . A method as recited in  claim 56 , wherein the surface of the substrate is substantially cylindrical. 
     
     
         63 . A method as recited in  claim 56 , wherein the surface of the substrate comprises a plurality of regions, at least some of which substantially coincide with a cylindrical shape. 
     
     
         64 . A method as recited in  claim 56 , wherein the first tooth and the second tooth are both part of a first cutting plate. 
     
     
         65 . A method as recited in  claim 56 , wherein the method further comprises:
 rotating at least one of the substrate surface, the first tooth and the second tooth such that the surface of the substrate rotates, relative to the first tooth and the second tooth, about a first axis, and   moving at least one of the substrate surface, the first tooth and the second tooth such that the substrate surface moves, relative to the first tooth and the second tooth, along the first axis.   
     
     
         66 . A method as recited in  claim 65 , wherein the surface of the substrate is substantially cylindrical and the first groove is substantially helical. 
     
     
         67 . A method as recited in  claim 56 , wherein:
 the first tooth and the second tooth are both part of a first cutting plate,   the first cutting plate further comprises at least a third tooth,   the method further comprises contacting the substrate with the third tooth.   
     
     
         68 . A method as recited in  claim 67 , wherein the first cutting plate further comprises at least a fourth tooth, a fifth tooth, a sixth tooth, a seventh tooth, an eighth tooth, a ninth tooth and a tenth tooth. 
     
     
         69 . A method as recited in  claim 56 , wherein the first tooth and the second tooth are both integral with a first cutting plate. 
     
     
         70 . A method for treating a surface of a substrate, the method comprising:
 forming at least a first groove in the surface of the substrate, the first groove having a first groove shape; and   altering the first groove shape by contacting the substrate with a first displacement structure.   
     
     
         71 . A method as recited in  claim 70 , wherein the surface of the substrate is a surface of a bore in an engine block. 
     
     
         72 . A method as recited in  claim 71 , wherein the engine block comprises aluminum. 
     
     
         73 . A method as recited in  claim 71 , wherein the bore is cylindrical. 
     
     
         74 . A method as recited in  claim 70 , wherein the altering the first groove shape results in the first groove being an undercut groove. 
     
     
         75 . A method as recited in  claim 70 , wherein the altering the first groove shape results in a constricting of an opening of the first groove. 
     
     
         76 . A method as recited in  claim 70 , wherein the forming at least a first groove in the surface of the substrate comprises displacing a portion of the substrate, without removing any material from the substrate, by contacting the substrate with at least a second displacement structure. 
     
     
         77 . A method as recited in  claim 76 , wherein the altering the first groove shape comprises deforming the first groove shape by contacting the substrate with at least the first displacement structure. 
     
     
         78 . A method as recited in  claim 76 , wherein:
 the substrate comprises a first axis,   the method comprises rotating the substrate about the first axis while moving at least one of (1) the substrate, (2) the first displacement structure and (3) the second displacement structure at least along the first axis, the moving resulting in changing the relative position along the first axis of the substrate relative to the first displacement structure and the second displacement structure.   
     
     
         79 . A method as recited in  claim 78 , wherein the moving comprises moving the first displacement structure and the second displacement structure along the first axis and not moving the substrate along the first axis. 
     
     
         80 . A method as recited in  claim 78 , wherein the moving comprises moving the substrate along the first axis and not moving the first displacement structure and the second displacement structure along the first axis. 
     
     
         81 . A method as recited in  claim 76 , wherein the first displacement structure and the second displacement structure are both integral with a first plate. 
     
     
         82 . A method as recited in  claim 81 , wherein:
 the method further comprises contacting the substrate with at least one first groove-altering structure, the first groove-altering structure spaced from the second displacement structure by a first pitch, the first displacement structure spaced from the first groove-altering structure by a distance that (1) differs from the first pitch and (2) differs from any multiple of the first pitch.   
     
     
         83 . A method as recited in  claim 82 , wherein the first groove-altering structure is a cutting structure. 
     
     
         84 . A method as recited in  claim 82 , wherein the first groove-altering structure is a displacement structure. 
     
     
         85 . A method as recited in  claim 82 , wherein:
 the method comprises rotating the substrate about the first axis while moving at least one of (1) the substrate, (2) the first displacement structure and (3) the second displacement structure at least along the first axis, the moving resulting in changing the relative position along the first axis of the substrate relative to the first displacement structure and the second displacement structure, and   the rate of changing the relative position along the first axis of the substrate relative to the first displacement structure and the second displacement structure is equal to a product of: (1) the rate of rotating the substrate about the first axis times (2) the first pitch.   
     
     
         86 . A method as recited in  claim 81 , wherein:
 the method further comprises contacting the substrate with two or more groove-altering structures, a first of the groove-altering structures spaced from the second displacement structure by a first pitch, each groove-altering structure spaced from the second displacement structure by (1) the first pitch or (2) a multiple of the first pitch, the first displacement structure spaced from the first groove-altering structure by a distance that differs from the first pitch and that differs from any multiple of the first pitch.   
     
     
         87 . A method as recited in  claim 70 , wherein the forming at least a first groove in the surface of the substrate comprises removing a portion of the substrate by contacting the substrate with at least a first cutting structure. 
     
     
         88 . A method as recited in  claim 87 , wherein the altering the first groove shape comprises deforming the first groove shape by contacting the substrate with at least the first displacement structure. 
     
     
         89 . A method as recited in  claim 87 , wherein:
 the substrate comprises a first axis,   the method comprises rotating the substrate about the first axis while moving at least one of (1) the substrate, (2) the first displacement structure and (3) the first cutting structure at least along the first axis, the moving resulting in changing the relative position along the first axis of the substrate relative to the first displacement structure and the first cutting structure.   
     
     
         90 . A method as recited in  claim 87 , wherein the first cutting structure and the first displacement structure are both integral with a first plate. 
     
     
         91 . A method as recited in  claim 90 , wherein:
 the method further comprises contacting the substrate with at least a first groove-altering structure, the first groove-altering structure spaced from the first cutting structure by a first pitch, the first displacement structure spaced from the first groove-altering structure by a distance that (1) differs from the first pitch and (2) differs from any multiple of the first pitch.   
     
     
         92 . A method as recited in  claim 91 , wherein:
 the method comprises rotating the substrate about the first axis while moving at least one of (1) the substrate, (2) the first displacement structure and (3) the first cutting structure at least along the first axis, the moving resulting in changing the relative position along the first axis of the substrate relative to the first displacement structure and the first cutting structure, and   the rate of changing the relative position along the first axis of the substrate relative to the first displacement structure and the first cutting structure is equal to product of: (1) the rate of rotating the substrate about the first axis times (2) the first pitch.   
     
     
         93 . A method as recited in  claim 90 , wherein:
 the method further comprises contacting the substrate with two or more groove-altering structures, a first of the groove-altering structures spaced from the first cutting structure by a first pitch, each groove-altering structure spaced from the first cutting structure by (1) the first pitch or (2) a multiple of the first pitch, the first displacement structure spaced from the first groove-altering structure by a distance that differs from the first pitch and that differs from any multiple of the first pitch.   
     
     
         94 . A method as recited in  claim 70 , wherein the contacting the substrate with a first displacement structure comprises contacting the substrate in locations where the first groove is not located. 
     
     
         95 . A method as recited in  claim 70 , wherein the method comprises forming two or more grooves in the surface of the substrate. 
     
     
         96 . A method as recited in  claim 95 , wherein the contacting the substrate with a first displacement structure comprises contacting the substrate in locations where none of the two or more grooves is located. 
     
     
         97 . A method as recited in  claim 70 , wherein:
 the first displacement structure is integral with a first plate,   the first plate comprises at least the first displacement structure and a second displacement structure,   the substrate comprises a first axis,   the forming at least a first groove in the surface comprises rotating the substrate about the first axis while moving at least one of (1) the substrate, (2) the first displacement structure and (3) the second displacement structure at least along the first axis, the moving resulting in changing the relative position along the first axis of the substrate relative to the first displacement structure and the second displacement structure, and   the first groove is helical.   
     
     
         98 . A method as recited in  claim 97 , wherein:
 the first plate further comprises at least a first groove-altering structure,   the rotating the substrate about the first axis while moving at least one of (1) the substrate, (2) the first displacement structure and (3) the second displacement structure at least along the first axis also results in the first groove-altering structure altering at least a portion of the helical first groove.   
     
     
         99 . A method as recited in  claim 98 , wherein the first groove-altering structure is a third displacement structure. 
     
     
         100 . A method as recited in  claim 98 , wherein the first groove-altering structure is a first cutting structure. 
     
     
         101 . A method as recited in  claim 98 , wherein the rotating the substrate about the first axis while moving at least one of (1) the substrate, (2) the first displacement structure and (3) the second displacement structure at least along the first axis also results in the first displacement structure contacting the substrate in locations where the first helical groove is not located. 
     
     
         102 . A method as recited in  claim 70 , wherein:
 the first displacement structure is integral with a first plate,   the first plate comprises at least the first displacement structure and a first cutting structure,   the substrate comprises a first axis,   the forming at least a first groove in the surface comprises rotating the substrate about the first axis while moving at least one of (1) the substrate, (2) the first displacement structure and (3) the first cutting structure at least along the first axis, the moving resulting in changing the relative position along the first axis of the substrate relative to the first displacement structure and the first cutting structure, and   the first groove is helical.   
     
     
         103 . A method as recited in  claim 102 , wherein:
 the first plate further comprises at least a first groove-altering structure,   the rotating the substrate about the first axis while moving at least one of (1) the substrate, (2) the first displacement structure and (3) the first cutting structure at least along the first axis also results in the first groove-altering structure altering at least a portion of the helical first groove.   
     
     
         104 . A method as recited in  claim 70 , wherein:
 the first groove shape is formed using a first tooth, and   the first tooth and the first displacement structure are both integral with a first cutting plate.