Selective oled vapor deposition using electric charges

Abstract

A selective organic emissive material deposition technique is disclosed. A charged organic emissive material may be mixed with a carrier gas and ejected towards a charged intended area of a substrate. The charge for the emissive material may be such that the organic emissive material is attracted to the charged intended area of the substrate and, accordingly, deposited selectively over the charged intended area of the substrate. Additionally, surrounding unintended areas of the substrate may be charged such that the charged organic emissive material is repelled by the unintended areas.

1 - 13 . (canceled) 
     
     
         14 . A system comprising:
 a first carrier gas source;   a first organic emissive material source; and   a delivery system comprising a feed conduit, a mixing region, and a first nozzle at least one of which is configured to:
 apply a first charge to a portion of a first mixture, the first mixture comprising the first organic emissive material and the first carrier gas; and 
 eject the charged first mixture toward a substrate from the first nozzle. 
   
     
     
         15 . The system of  claim 14 , further comprising:
 a substrate mount configured to apply a second charge to the substrate, the second charge being of opposite sign to the first charge.   
     
     
         16 . The system of  claim 14 , further comprising:
 a second nozzle configured to:
 apply a second charge to a second mixture comprising a second organic emissive material and a second carrier gas; and 
 eject the charged second mixture toward the substrate from the second nozzle. 
   
     
     
         17 . The system of  claim 14 , further comprising a first nozzle block having a first set of nozzles and a second block having a second set of nozzles. 
     
     
         18 . The system of  claim 17 , wherein the nozzles in the first nozzle block eject organic emissive layer material over a substrate block at different times than the nozzles in the second nozzle block such that the nozzle block ejecting over the substrate block at a current time is an active nozzle block. The system of  claim 17 , further comprising a first data line configured to apply a third charge to a first set of electrodes and a second data line configured to apply a fourth charge to a second set of electrodes. 
     
     
         19 . The system of  claim 18 , wherein the third charge and the fourth charge are the same sign. 
     
     
         20 . The system of  claim 18 , wherein the third charge and the fourth charge are the opposite sign. 
     
     
         21 . The system of  claim 18 , further configured to apply a charge to the first or the second data line based on the active nozzle block. 
     
     
         22 . The system of  claim 17 , wherein nozzles in the first nozzle block eject an organic emissive layer material over a first substrate block at a first time and a second substrate block at a second time. 
     
     
         23 . The system of  claim 17 , wherein the nozzles in the first nozzle block eject organic emissive layer material over a first substrate location at the same time as the nozzles in the second nozzle block eject organic emissive layer material over a second substrate location. 
     
     
         24 . The system of  claim 22 , wherein nozzles in the second nozzle block eject an organic emissive layer material over the first substrate block at the second time. 
     
     
         25 . The system of  claim 14 , wherein the organic emissive material forms a patterned layer on the substrate. 
     
     
         26 . (canceled)