Electronic apparatus

Abstract

There is provided an electronic apparatus having a novel means capable of suppressing temperature rise of a heat generating element. The electronic apparatus ( 20 ), which includes a heat generating element, is provided with a device (or a chemical heat pump) ( 10 ) comprising: a reaction chamber ( 1 ) containing a chemical heat storage material showing an endothermic reaction in response to heat emitted by the heat generating element ( 11 ); a condensation/evaporation chamber ( 3 ) for condensing or evaporating a condensable component produced from the endothermic reaction of the chemical heat storage material; and a communication part ( 5 ) communicating the reaction chamber ( 1 ) with the condensation/evaporation chamber ( 3 ) such that the condensable component is movable between the reaction chamber ( 1 ) and the condensation/evaporation chamber ( 3 ).

1 . An electronic apparatus comprising:
 a heat generating element; and   a device comprising: a reaction chamber containing a chemical heat storage material showing an endothermic reaction in response to heat emitted by the heat generating element; a condensation/evaporation chamber for condensing or evaporating a condensable component produced from the endothermic reaction of the chemical heat storage material; and a communication part communicating the reaction chamber with the condensation/evaporation chamber such that the condensable component is movable between the reaction chamber and the condensation/evaporation chamber through the communication part.   
     
     
         2 . The electronic apparatus according to  claim 1 , wherein the communication part is provided with a filter allowing gas to pass through but not substantially allowing solid and liquid to pass through. 
     
     
         3 . The electronic apparatus according to  claim 1 , wherein the chemical heat storage material is molded or packed in the reaction chamber, and a minimum cross-sectional dimension of the molded or packed chemical heat storage material is larger than a minimum cross-sectional dimension of the communication part. 
     
     
         4 . The electronic apparatus according to  claim 1 , wherein the condensation/evaporation chamber contains a material capable of trapping liquid, or at least a portion of an inner surface of the condensation/evaporation chamber is made of the material capable of trapping liquid. 
     
     
         5 . The electronic apparatus according to  claim 1 , wherein the reaction chamber comprises a portion made of a heat conductive material, and the portion made of the heat conductive material is placed in contact with the heat generating element directly or indirectly. 
     
     
         6 . The electronic apparatus according to  claim 1 , wherein the electronic apparatus further comprises a heat conductive member, and
 the condensation/evaporation chamber comprises a portion made of a heat conductive material, and the portion made of the heat conductive material is placed in contact with the heat conductive member directly or indirectly.   
     
     
         7 . The electronic apparatus according to  claim 6 , the heat conductive member is selected from the group consisting of a housing of the electronic apparatus, an exterior of a battery, a substrate and a display. 
     
     
         8 . The electronic apparatus according to  claim 1 , the heat generating element is selected from the group consisting of an integrated circuit, a light emitting element, a field effect transistor, a motor, a coil, a converter, an inverter and a capacitor. 
     
     
         9 . An electronic apparatus comprising:
 a first member and a second member; and   a device comprising: a reaction chamber containing a chemical heat storage material showing an endothermic reaction and an exothermic reaction reversibly; a condensation/evaporation chamber for condensing or evaporating a condensable component produced from the endothermic reaction of the chemical heat storage material; and a communication part communicating the reaction chamber with the condensation/evaporation chamber;   wherein the first member is thermally combined with the reaction chamber, and the condensation/evaporation chamber is thermally combined with the second member.   
     
     
         10 . The electronic apparatus according to  claim 9 , wherein the communication part is provided with a filter allowing gas to pass through but not substantially allowing solid and liquid to pass through. 
     
     
         11 . The electronic apparatus according to  claim 9 , wherein the chemical heat storage material is molded or packed in the reaction chamber, and a minimum cross-sectional dimension of the molded or packed chemical heat storage material is larger than a minimum cross-sectional dimension of the communication part. 
     
     
         12 . The electronic apparatus according to  claim 9 , wherein the condensation/evaporation chamber contains a material capable of trapping liquid, or at least a portion of an inner surface of the condensation/evaporation chamber is made of the material capable of trapping liquid. 
     
     
         13 . The electronic apparatus according to  claim 9 , wherein when a temperature of the first member is increased and/or a temperature of the second member is decreased, heat is transferred from the first member to the reaction chamber, the chemical heat storage material produces the condensable component by the endothermic reaction in the reaction chamber, the condensable component moves in a gaseous state from the reaction chamber to the condensation/evaporation chamber through the communication part, the condensable component is condensed in the condensation/evaporation chamber to generate heat, and the generated heat is transferred from the condensation/evaporation chamber to the second member. 
     
     
         14 . The electronic apparatus according to  claim 9 , wherein when a temperature of the first member is decreased and/or a temperature of the second member is increased, heat is transferred from the reaction chamber to the first member, the exothermic reaction occurs to consume the condensable component in the reaction chamber, the condensable component in a gaseous state moves from the condensation/evaporation chamber to the reaction chamber through the communication part, the condensable component condensed in the condensation/evaporation chamber gains the heat and evaporates, and the heat is transferred from the second member to the condensation/evaporation chamber. 
     
     
         15 . The electronic apparatus according to  claim 1 , wherein the condensable component is water. 
     
     
         16 . An electronic apparatus having a function of suppressing a temperature rise of a heating generating element, comprising:
 a heat generating element; and   at least one reaction chamber containing a chemical heat storage material,   wherein heat generated from the heat generating element is transferred from an outer surface of the heat generating element to the chemical heat storage material in the at least one reaction chamber, and the chemical heat storage material absorbs the heat by a reaction to suppress the temperature rise of the heat generating element.   
     
     
         17 . The electronic apparatus according to  claim 16 , wherein the electronic apparatus comprises a first reaction chamber containing a first chemical heat storage material, and a second reaction chamber containing a second chemical heat storage material, and a first communication part communicating the first reaction chamber with the second reaction chamber, and
 wherein the first chemical heat storage material and the second chemical heat storage material absorb or generate heat by reactions involving a same component,   the first reaction chamber and the second reaction chamber communicate with each other by a the first communication part to allow said component to move through the first communication part, and   the heat generated from the heat generating element is transferred to either the first chemical heat storage material in the first reaction chamber or the second heat storage material in the second reaction chamber.   
     
     
         18 . The electronic apparatus according to  claim 17 , wherein the first chemical heat storage material is molded or packed in the first reaction chamber, and a minimum cross-sectional dimension of the molded or packed first chemical heat storage material is larger than a minimum cross-sectional dimension of the first communication part. 
     
     
         19 . The electronic apparatus according to  claim 17 , wherein the second chemical heat storage material is molded or packed in the second reaction chamber, and a minimum cross-sectional dimension of the molded or packed second chemical heat storage material is larger than a minimum cross-sectional dimension of the first communication part. 
     
     
         20 . The electronic apparatus according to  claim 17 , wherein the electronic apparatus further comprises a condensation/evaporation chamber for condensing or evaporating said component,
 wherein the condensation/evaporation chamber communicates with the first communication part between the first reaction chamber and the second reaction chamber to allow said component to move to and from the condensation/evaporation chamber.   
     
     
         21 . The electronic apparatus according to  claim 20 , wherein the electronic apparatus further comprises a second communication part communicating the condensation/evaporation chamber with the first communication part, and
 wherein either the first communication part or the second communication part is provided with a filter allowing gas to path through but not substantially allowing solid and liquid to path through.   
     
     
         22 . The electronic apparatus according to  claim 17 , wherein the electronic apparatus further comprises a condensation/evaporation chamber for condensing or evaporating said component, and a third communication part communicating the condensation/evaporation chamber with either the first reaction chamber or the second reaction chamber
 wherein the condensation/evaporation chamber communicates with either the first reaction chamber or the second reaction chamber by the third communication part to allow said component to move to and from the condensation/evaporation chamber.   
     
     
         23 . The electronic apparatus according to  claim 22 , the third communication part is provided with a filter allowing gas to pass through but not substantially allowing solid and liquid to pass through. 
     
     
         24 . The electronic apparatus according to  claim 20 , wherein the condensation/evaporation chamber contains a material capable of trapping liquid, or at least a portion of an inner surface of the condensation/evaporation chamber is made of the material capable of trapping liquid. 
     
     
         25 . The electronic apparatus according to  claim 20 , wherein said component is water. 
     
     
         26 . The electronic apparatus according to  claim 1 , the chemical heat storage material shows an endothermic reaction at a temperature of 30 to 200° C. 
     
     
         27 . The electronic apparatus according to  claim 1 , wherein, in place of the chemical heat storage material, the reaction chamber contains at least one heat storage material selected form the group consisting of zeolite, silica gel, mesoporous silica and activated carbon.