Apparatuses facilitating fluid flow into via holes, vents, and other openings communicating with surfaces of substrates of semiconductor device components

Abstract

A method for removing material from surfaces of at least a portion of at least one recess or at least one aperture extending into a surface of a substrate includes pressurizing fluid so as to cause the fluid to flow into the at least one recess or the at least one aperture. The fluid may be pressurized by generating a pressure differential across the substrate, which causes the fluid to flow into or through the at least one aperture or recess. Apparatus for pressurizing fluid so as to cause it to flow into or through recesses or apertures in a substrate are also disclosed.

1 . A method for removing material from surfaces of a substrate, comprising:
 delivering substrates into substrate holders located substantially along a single boundary between a first region of a chamber and a second region of a chamber, each of the substrate holders configured to substantially cover and couple to only an outer periphery of a substrate such that fluid communication between the first region of the chamber and the second region of the chamber is limited to at least one aperture extending substantially through the substrate; and   pressurizing fluid with at least one pressurization component associated with at least one of the first region of the chamber and the second region of the chamber so as to cause the fluid to flow into the at least one aperture.   
     
     
         2 . The method of  claim 1 , wherein pressurizing fluid with at least one pressurization component comprises generating a pressure differential across the single boundary along which the substrate is substantially positioned. 
     
     
         3 . The method of  claim 1 , wherein pressurizing fluid with at least one pressurization component comprises directing the fluid under pressure toward the surface of the substrate. 
     
     
         4 . A method for removing obstructions or irregularities from surfaces of at least one aperture extending substantially through a substrate, comprising:
 delivering a substrate into a substrate holder located substantially along a boundary within a chamber of a differential pressure apparatus, the substrate holder comprising:
 at least one recess configured to contain and support a peripheral portion of the substrate; 
 at least one opening extending across substantially all of a central portion of the substrate adjacent the peripheral portion of the substrate; and 
 at least one sealing element configured to limit fluid communication between a first region of the chamber and a second region of the chamber to at least one aperture extending substantially through the substrate; and 
   pressurizing an etchant with at least one pressurization component to force the etchant into an opening of the at least one aperture at a first surface of the substrate, through the at least one aperture, and out another out an opening of the at least one aperture at a second surface of the substrate.   
     
     
         5 . The method of  claim 4 , wherein pressurizing an etchant with at least one pressurization component comprises forcing the etchant into and through the at least one aperture in a pulsed manner. 
     
     
         6 . The method of  claim 4 , further comprising forcing the etchant into the another opening of the at least one aperture at the second surface of the substrate, through the at least one aperture, and out of the opening of the at least one aperture at the first surface of the substrate. 
     
     
         7 . The method of  claim 6 , wherein forcing the etchant into the opening of the at least one aperture at the first surface of the substrate and forcing the etchant into the another opening of the at least one aperture at the second surface of the substrate are effected sequentially. 
     
     
         8 . The method of  claim 4 , further comprising delivering another substrate into another substrate holder located substantially along the boundary within the chamber. 
     
     
         9 . The method of  claim 4 , further comprising delivering another substrate into another substrate holder located substantially along another boundary within the chamber, the first region of the chamber disposed between the substrate holder and the another substrate holder. 
     
     
         10 . The method of  claim 9 , wherein pressurizing an etchant with at least one pressurization component comprises pressurizing the etchant within the first region of the chamber. 
     
     
         11 . The method of  claim 4 , wherein pressurizing an etchant with at least one pressurization component comprises applying positive pressure to the etchant at the opening of the at least one aperture at the first surface of the substrate. 
     
     
         12 . The method of  claim 11 , further comprising applying negative pressure to the second surface of the substrate while applying the positive pressure to the etchant at the opening of the at least one aperture at the first surface of the substrate. 
     
     
         13 . The method of  claim 4 , wherein the at least one sealing element of the substrate holder is positioned within the at least one recess of the substrate holder to abut the peripheral portion of the substrate. 
     
     
         14 . The method of  claim 4 , wherein the at least one sealing element of the substrate holder comprises at least two sealing elements positioned within the at least one recess of the substrate holder to abut opposing surfaces of the peripheral portion of the substrate. 
     
     
         15 . The method of  claim 1 , wherein delivering substrates into substrate holders located substantially along a single boundary between a first region of a chamber and a second region of a chamber comprises delivering the substrates into the substrate holders located along a substantially linear boundary between the first region of the chamber and the second region of the chamber. 
     
     
         16 . The method of  claim 1 , wherein delivering substrates into substrate holders located substantially along a single boundary between a first region of a chamber and a second region of a chamber delivering the substrates into the substrate holders located along a substantially annular boundary between the first region of the chamber and the second region of the chamber. 
     
     
         17 . The method of  claim 1 , further comprising delivering at least one additional substrate into at least one additional substrate holder located substantially along another boundary spaced apart from the single boundary between the first region of the chamber and the second region of the chamber. 
     
     
         18 . The method of  claim 1 , wherein pressurizing fluid with at least one pressurization component associated with at least one of the first region of the chamber and the second region of the chamber comprises generating positive pressure within the first region of the chamber. 
     
     
         19 . The method of  claim 18 , further comprising generating positive pressure within the second region of the chamber after generating positive pressure within the first region of the chamber. 
     
     
         20 . The method of  claim 1 , wherein pressurizing fluid with at least one pressurization component associated with at least one of the first region of the chamber and the second region of the chamber comprises generating negative pressure within the first region of the chamber.