Enhanced die-up ball grid array and method for making the same

Abstract

Methods of assembling a ball grid array (BGA) package is provided. One method includes providing a tape substrate that has a first surface and a second surface, attaching a first surface of a stiffener to the first substrate surface, mounting an IC die to the second stiffener surface, mounting a heat spreader to the IC die, and attaching a plurality of solder balls to the second substrate surface.

1 - 15 . (canceled) 
     
     
         16 . A ball-grid array (BGA) package comprising:
 a substrate;   a stiffener having a first surface and a second surface, the first surface of the stiffener being in contact with a first surface of the substrate;   an integrated circuit (IC) die having a first surface and a second surface, the first surface of the IC die being in contact with the second surface of the stiffener; and   a heat spreader having a first surface and a second surface, the first surface of the heat spreader being in contact with the second surface of the IC die, and the second surface of the heat spreader being exposed.   
     
     
         17 . The BGA package of  claim 16 , further comprising a plurality of coupling elements attached to the second surface of the substrate. 
     
     
         18 . The BGA package of  claim 16 , wherein the plurality of coupling elements connect to vias on the second surface of the substrate to which signals internal to the substrate are routed and exposed. 
     
     
         19 . The BGA package of  claim 16 , further comprising one or more wire bonds configured to connect corresponding bond pads on the IC die to contact points on the substrate. 
     
     
         20 . The BGA package of  claim 19 , wherein the wire bonds extend through one or more openings of the stiffener to form connections with the substrate. 
     
     
         21 . The BGA package of  claim 16 , wherein the heat spreader is attached to the second surface of the IC die using an adhesive element. 
     
     
         22 . The BGA package of  claim 16 , wherein the heat spreader is embedded within a compound formed on the stiffener and the IC die. 
     
     
         23 . The BGA package of  claim 16 , wherein a size of the heat spreader is smaller than the second surface of the IC die. 
     
     
         24 . The BGA package of  claim 16 , wherein the exposed second surface of the heat spreader forms a portion of a top surface of the BGA package. 
     
     
         25 . The BGA package of  claim 16 , further comprising one or more heat sinks attached to the heat spreader. 
     
     
         26 . A ball-grid array (BGA) package comprising:
 a substrate;   a stiffener having a first surface and a second surface, the first surface of the stiffener being in contact with a first surface of the substrate;   an integrated circuit (IC) die having a first surface and a second surface, the first surface of the IC die being in contact with the second surface of the stiffener; and   a heat spreader having a first surface and a second surface, the first surface of the heat spreader being in contact with the second surface of the IC die, and the second surface of the heat spreader being exposed, wherein the heat spreader is embedded within a compound formed on the stiffener and the IC die, and wherein the exposed second surface of the heat spreader forms a portion of a top surface of the BGA package.   
     
     
         27 . The BGA package of  claim 26 , further comprising a plurality of coupling elements attached to the second surface of the substrate. 
     
     
         28 . The BGA package of  claim 26 , wherein the plurality of coupling elements connect to vias on the second surface of the substrate to which signals internal to the substrate are routed and exposed. 
     
     
         29 . The BGA package of  claim 26 , further comprising one or more wire bonds configured to connect corresponding bond pads on the IC die to contact points on the substrate. 
     
     
         30 . The BGA package of  claim 29 , wherein the wire bonds extend through one or more openings of the stiffener to form connections with the substrate. 
     
     
         31 . The BGA package of  claim 26 , wherein the heat spreader is attached to the second surface of the IC die using an adhesive element. 
     
     
         32 . The BGA package of  claim 26 , wherein a size of the heat spreader is smaller than the second surface of the IC die. 
     
     
         33 . The BGA package of  claim 26 , further comprising one or more heat sinks attached to the heat spreader.