Heat conveying structure for electronic device

Abstract

A heat conveying structure for an electronic device, the heat conveying structure including an evaporating section that has a chamber structure with first fins erected therein, is thermally connected to the electronic device, evaporates a liquid coolant on the surfaces of the first fins to thereby change the liquid coolant to a vapor coolant, and sends out liquid coolant present near the first fins along with the vapor coolant as a gas-liquid two-phase flow coolant, a condensing section that has a chamber structure with second fins erected therein, and changes the gas-liquid two-phase flow coolant in contact with the second fins to a liquid coolant, a vapor pipe that connects the evaporating section and the condensing section, and moves the gas-liquid two-phase flow coolant sent out from the evaporating section to the condensing section, and a liquid pipe that connects the evaporating section and the condensing section.

What is claimed:  
     
         1 . A heat conveying structure for an electronic device, the heat conveying structure comprising:
 an evaporating section that has a chamber structure with first fins erected therein, is thermally connected to the electronic device, evaporates a liquid coolant on the surfaces of the first fins to thereby change the liquid coolant to a vapor coolant, and sends out liquid coolant present near the first fins along with the vapor coolant as a gas-liquid two-phase flow coolant;   a condensing section that has a chamber structure with second fins erected therein, and changes the gas-liquid two-phase flow coolant in contact with the second fins to a liquid coolant;   a vapor pipe that connects the evaporating section and the condensing section, and moves the gas-liquid two-phase flow coolant sent out from the evaporating section to the condensing section; and   a liquid pipe that connects the evaporating section and the condensing section, and moves the liquid coolant from the condensing section to the evaporating section,   wherein the electronic device is mounted on a rack, a cold water pipe causing cold water to flow into and flow out from the rack is provided, a jacket that performs cooling by circulating the cold water, and the cold water pipe are connected by a tube, and the condensing section is connected to the jacket for each electronic device.   
     
     
         2 . The heat conveying structure for an electronic device according to  claim 1 , wherein the first and second fins comprise plate fins with a gap between the fins being in a range of from 1 mm to 2 mm inclusive. 
     
     
         3 . The heat conveying structure for an electronic device according to  claim 1 , wherein each of the evaporating section and the condensing section includes: a vapor port that is provided in a direction opposite to a gravity direction; and a liquid port that is provided at a position opposite to the vapor port with the first or second fins therebetween. 
     
     
         4 . A heat conveying structure for an electronic device, the heat conveying structure comprising:
 an evaporating section that has a chamber structure with first fins erected therein, is thermally connected to the electronic device, evaporates a liquid coolant on the surfaces of the first fins to thereby change the liquid coolant to a vapor coolant, and sends out liquid coolant present near the first fins along with the vapor coolant as a gas-liquid two-phase flow coolant;   a condensing section that has a chamber structure with second fins erected therein, and changes the gas-liquid two-phase flow coolant in contact with the second fins to a liquid coolant;   a vapor pipe that connects the evaporating section and the condensing section, and moves the gas-liquid two-phase flow coolant sent out from the evaporating section to the condensing section; and   a liquid pipe that connects the evaporating section and the condensing section, and moves the liquid coolant from the condensing section to the evaporating section,   wherein the heat conveying structure for an electronic device is provided between the electronic device and a cooler provided outside of the electronic device.   
     
     
         5 . The heat conveying structure for an electronic device according to  claim 1 , wherein the first and second fins comprise plate fins with a gap between the fins being in a range of from 1 mm to 2 mm inclusive. 
     
     
         6 . The heat conveying structure for an electronic device according to  claim 4 , wherein the electronic device is mounted on a rack, and the condensing section is thermally connected to the cooler provided outside the rack.