US2015133354A1PendingUtilityA1
Aqueous processing liquid
Est. expiryJun 29, 2032(~5.9 yrs left)· nominal 20-yr term from priority
Inventors:Tomohiko Kitamura
C10M 2209/084C10N 2020/02C10M 173/02C10N 2040/22C10N 2030/02B28D 5/007C10M 2209/104C10N 2020/04C10M 2209/103C10M 107/34Y02P70/10
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Claims
Abstract
An aqueous processing liquid used for cutting a fragile material using a wire saw contains a water-soluble polymer, in which the water-soluble polymer has a mass average molecular weight in a range of 3×10 3 to 6×10 5 , and the aqueous processing liquid exhibits a viscosity at 25 degrees C. in a range of 1.5 mPa·s to 15 Pa·s.
Claims
exact text as granted — not AI-modified1 . An aqueous processing liquid used for cutting a fragile material using a wire saw, comprising:
a water-soluble polymer, wherein the water-soluble polymer has a mass average molecular weight in a range of 3×10 3 to 6×10 5 , and the aqueous processing liquid exhibits a viscosity at 25 degrees C. in a range of 1.5 mPa·s to 15 Pa·s.
2 . The aqueous processing liquid according to claim 1 , wherein
the wire saw is a fixed abrasive grain wire saw.
3 . The aqueous processing liquid according to claim 2 , wherein
the fixed abrasive grain wire saw has a wire diameter of 0.2 mm or less.
4 . The aqueous processing liquid according to claim 1 , wherein
a content of the water-soluble polymer is in a range of 0.5 mass % to 40 mass % of a total amount of the processing liquid.
5 . The aqueous processing liquid according to claim 1 , further comprising:
at least one of a rust inhibitor, friction modifier, antifoaming agent, metal deactivator, bactericide (preservative) and pH adjuster.
6 . The aqueous processing liquid according to claim 1 , wherein
the fragile material is a silicon ingot.Join the waitlist — get patent alerts
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