US2015129540A1PendingUtilityA1
Process for metallizing nonconductive plastic surfaces
Est. expiryJun 5, 2032(~5.8 yrs left)· nominal 20-yr term from priority
C23C 18/40C23C 18/34C23C 18/285C23C 18/36C23C 18/405C23C 18/30C23C 22/78C23C 18/24C23C 18/2046C23C 18/1651C23C 18/2086
39
PatentIndex Score
0
Cited by
0
References
0
Claims
Abstract
The present invention relates to a process for metallizing nonconductive plastics using an etching solution free of both trivalent chromium and hexavalent chromium. The etching solution is based on an sulphuric acidic solution containing a source of chlorate ions. After the treatment of the plastics with the etching solution, the plastics are metallized by means of known processes.
Claims
exact text as granted — not AI-modified1 . Process for metallizing electrically nonconductive plastic surfaces of articles, comprising the process steps of:
A) etching the plastic surface with an aqueous etching solution; B) treating the plastic surface with a solution of a metal colloid or of a compound of a metal, the metal being selected from the metals of transition group I of the Periodic Table of the Elements and transition group VIII of the Periodic Table of the Elements, and C) metallizing the plastic surface with a metallizing solution;
characterized in that the etching solution comprises a source of chlorate ions resulting in a concentration of 0.0016 to 0.12 mol/l of chlorate ions and 50-80% v/v sulfuric acid,
wherein the etching solution is free of chromium III ions and is free of chromium VI ions.
2 . Process according to claim 1 , characterized in that the source for chlorate ions in the etching solution in process step A) is selected from sodium and potassium chlorate.
3 . Process according to claim 1 , characterized in that the chlorate ion concentration ranges between 0.003 and 0.08 mol/l.
4 . Process according to claim 1 , characterized in that the chlorate ion concentration ranges between 0.01 and 0.06 mol/l.
5 . Process according to claim 1 , characterized in that the chlorate ion concentration ranges between 0.004 and 0.04 mol/l.
6 . Process according to claim 1 , characterized in that the sulfuric acid ion concentration ranges between 60 and 70 vol. %.
7 . Process according to claim 1 , characterized in that the etching solution further comprises a second oxidizing agent in an amount of 2 to 20 g/l with the standard oxidising potential exceeding that of chlorate ions.
8 . Process according to claim 1 , characterized in that the etching solution further comprises phosphoric acid.
9 . Process according to claim 8 , characterized in that the phosphoric acid concentration ranges between 10 and 30 vol. %.
10 . Process according to claim 1 , characterized in that metal in process step B) is palladium.
11 . Process according to claim 1 , characterized in that the plastic surface has been manufactured from at least one electrically nonconductive plastic and the at least one electrically nonconductive plastic is selected from an acrylonitrile-butadiene-styrene copolymer, a polyamide, a polycarbonate and a mixture of an acrylonitrile-butadiene-styrene copolymer with at least one further polymer.
12 . Process according to claim 1 , characterized in that the following further process step is performed between process steps A) and B):
A i) treating the plastic surface in a solution comprising a reducing agent for chlorate ions.
13 . Process according to claim 12 , characterized in that the reducing agent is selected from hydroxylammonium sulphate, hydroxylammonium chloride and hydrogen peroxide.
14 . Process according to claim 1 , characterized in that the following further process step is performed between process steps A) and B):
A i) treating the plastic surface in a solution comprising a neutralizing agent comprising a source of hydroxide ions.
15 . Process according to claim 1 , characterized in that the following further process steps are performed between process steps B) and C):
B i) treating the plastic surface in an aqueous acidic solution and B ii) electrolessly metallizing the plastic surface in a metallizing solution.
16 . Process according to claim 12 , characterized in that the following further process steps are performed between process steps B) and C):
B i) treating the plastic surface in an aqueous acidic solution and B ii) electrolessly metallizing the plastic surface in a metallizing solution.
17 . Process according to claim 14 , characterized in that the following further process steps are performed between process steps B) and C):
B i) treating the plastic surface in an aqueous acidic solution and B ii) electrolessly metallizing the plastic surface in a metallizing solution.
18 . Process according to claim 14 , characterized in that the following further process step is performed between process steps A) and B):
A ii) treating the plastic surface in a solution comprising a neutralizing agent comprising a source of hydroxide ions.
19 . Process according to claim 18 , characterized in that the following further process steps are performed between process steps B) and C):
B i) treating the plastic surface in an aqueous acidic solution and B ii) electrolessly metallizing the plastic surface in a metallizing solution.Join the waitlist — get patent alerts
Track US2015129540A1 — get alerts on status changes and closely related new filings.
We store only your email — no account needed. See our privacy policy.