US2015123259A1PendingUtilityA1

Thermal interface sheet and processor

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Assignee: FUJITSU LTDPriority: Nov 1, 2013Filed: Oct 27, 2014Published: May 7, 2015
Est. expiryNov 1, 2033(~7.2 yrs left)· nominal 20-yr term from priority
Inventors:Naoaki Nakamura
H10W 90/736H10W 90/734H10W 90/724H10W 76/40H10W 74/15H10W 72/07336H10W 72/01351H10W 72/877H10W 72/354H10W 72/352H10W 72/332H10W 72/321H10W 72/252H10W 72/073H10W 72/013H10W 70/02H10W 40/70H10W 40/258C22C 28/00B23K 35/26B23K 1/0016Y10T428/12458H01L 23/3736H01L 23/3675
52
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Claims

Abstract

A thermal interface sheet includes a peripheral portion, in a surface direction, configured to have a melting point higher than the melting point of a central portion in the surface direction.

Claims

exact text as granted — not AI-modified
What is claimed is: 
     
         1 . A thermal interface sheet comprising a peripheral portion, in a surface direction, configured to have a melting point higher than the melting point of a central portion in the surface direction. 
     
     
         2 . The thermal interface sheet according to  claim 1 , wherein the melting point increases stepwise from the central portion in the surface direction toward the peripheral portion in the surface direction. 
     
     
         3 . The thermal interface sheet according to  claim 1 , wherein the melting point increases little by little from the central portion in the surface direction toward the peripheral portion in the surface direction. 
     
     
         4 . The thermal interface sheet according to  claim 1 , wherein the material contains solder. 
     
     
         5 . A processor comprising:
 a semiconductor element configured to include a circuit surface;   a thermal interface layer which is formed from the thermal interface sheet according to any one of  claims 1  to  4  and which is disposed on the surface opposite to the circuit surface of the semiconductor element; and   a heat spreader disposed on the thermal interface layer.

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