Imprint method, imprint apparatus, and method of manufacturing semiconductor device

Abstract

In an imprint method of an embodiment, in the imprinting of an imprint shot including an outermost peripheral region of a substrate where resist is not desired to be entered at the time of imprinting, light curing the resist is applied to a light irradiation region with a predetermined width including a boundary between the outermost peripheral region and a pattern formation region more inside than the outermost peripheral region, whereby the resist which is to enter inside the outermost peripheral region is cured. Then, light curing the resist filled in a template pattern is applied onto a template.

1 - 17 . (canceled) 
     
     
         18 . An imprint method, comprising:
 dropping resist in a pattern formation region more inside than an outermost peripheral region which is a region on a substrate at a time of imprinting;   pressing a template pattern of a template against the resist on the substrate for each imprint shot and thereby filling the resist in the template pattern for each imprint shot;   in the imprinting of the imprint shot including the outermost peripheral region, when the template pattern is pressed against the resist, applying first light curing the resist to a light irradiation region with a predetermined width including a boundary between the outermost peripheral region and the pattern formation region and curing the resist which is near the boundary between the outermost peripheral region and the pattern formation region; and   applying second light, curing the resist filled in the template pattern, onto the template.   
     
     
         19 . The imprint method according to  claim 18 , wherein when the resist is filled, a position alignment processing between a first alignment mark provided on the substrate and a second alignment mark provided on the template is performed, whereby the template is positionally aligned with respect to a predetermined position on the substrate, and when the resist is cured, the first light is applied to the light irradiation region during the position alignment processing. 
     
     
         20 . The imprint method according to  claim 18 , wherein when the resist is filled, a position alignment processing between a first alignment mark provided on the substrate and a second alignment mark provided on the template is performed, whereby the template is positionally aligned with respect to a predetermined position on the substrate, and when the resist is cured, after the position alignment processing, the first light is applied to the light irradiation region during filling of the resist in the template pattern. 
     
     
         21 . The imprint method according to  claim 18 , wherein when the resist which is near the boundary between the outermost peripheral region and the pattern formation region is cured, the first light is applied to the light irradiation region through an aperture shielding light applied to other than the light irradiation region, and when the resist filled in the template pattern is cured, the second light is applied onto the template without interposition of the aperture. 
     
     
         22 . The imprint method according to  claim 18 , wherein when the resist which is near the boundary between the outermost peripheral region and the pattern formation region is cured, the first light is applied from a first light irradiation unit, irradiating the first light, to the light irradiation region, and when the resist filled in the template pattern is cured, the second light is applied from a second light irradiation unit, irradiating the second light, onto the template. 
     
     
         23 . The imprint method according to  claim 18 , wherein the resist is a UV curable resin, and the first light and the second light are UV light. 
     
     
         24 . An imprint apparatus, comprising:
 a dropping unit which drops resist in a pattern formation region more inside than an outermost peripheral region which is a region on a substrate at a time of imprinting;   an imprinting unit which presses a template pattern of a template against the resist on the substrate for each imprint shot and thereby fills the resist in the template pattern for each imprint shot; and   a light irradiation unit which performs a first curing processing of, in the imprinting of the imprint shot including the outermost peripheral region, when the template pattern is pressed against the resist, applying first light curing the resist to a light irradiation region with a predetermined width including a boundary between the outermost peripheral region and the pattern formation region and curing the resist which is near the boundary between the outermost peripheral region and the pattern formation region and a second curing processing of applying second light, curing the resist filled in the template pattern, onto the template and curing the resist filled in the template pattern.   
     
     
         25 . The imprint apparatus according to  claim 24 , further comprising an aperture which shields light applied to other than the light irradiation region,
 wherein when the first curing processing is performed, the light irradiation unit applies the first light to the light irradiation region through the aperture, and when the second curing processing is performed, the light irradiation unit applies the second light onto the template without interposition of the aperture.   
     
     
         26 . The imprint apparatus according to  claim 25 , wherein the aperture has a fan-shaped opening. 
     
     
         27 . The imprint apparatus according to  claim 26 , wherein the light irradiation unit rotates the aperture in a horizontal plane for each imprint shot and thereby applies the first light to the light irradiation region. 
     
     
         28 . The imprint apparatus according to  claim 24 , wherein the light irradiation unit has a first light irradiation unit which applies the first light to the light irradiation region when the first curing processing is performed and a second light irradiation unit which applies the second light onto the template when the second curing processing is performed. 
     
     
         29 . The imprint apparatus according to  claim 28 , wherein the second light irradiation unit is a ring-shaped light source. 
     
     
         30 . A method of manufacturing a semiconductor device, comprising:
 dropping resist in a pattern formation region more inside than an outermost peripheral region which is a region on a substrate at a time of imprinting;   pressing a template pattern of a template against the resist on the substrate for each imprint shot and thereby filling the resist in the template pattern for each imprint shot;   in the imprinting of the imprint shot including the outermost peripheral region, when the template pattern is pressed against the resist, applying first light curing the resist to a light irradiation region with a predetermined width including a boundary between the outermost peripheral region and the pattern formation region and curing the resist which is near the boundary between the outermost peripheral region and the pattern formation region;   applying second light, curing the resist filled in the template pattern, onto the template; and   processing the substrate from above of cured resist and thereby forming a pattern, corresponding to the template pattern, on the substrate.   
     
     
         31 . The method of manufacturing a semiconductor device according to  claim 30 , wherein when the resist is filled, a position alignment processing between a first alignment mark provided on the substrate and a second alignment mark provided on the template is performed, whereby the template is positionally aligned with respect to a predetermined position on the substrate, and when the resist is cured, the first light is applied to the light irradiation region during the position alignment processing. 
     
     
         32 . The method of manufacturing a semiconductor device according to  claim 30 , wherein when the resist is filled, a position alignment processing between a first alignment mark provided on the substrate and a second alignment mark provided on the template is performed, whereby the template is positionally aligned with respect to a predetermined position on the substrate, and when the resist is cured, after the position alignment processing, the first light is applied to the light irradiation region during filling of the resist in the template pattern. 
     
     
         33 . The method of manufacturing a semiconductor device according to  claim 30 , wherein when the resist which is near the boundary between the outermost peripheral region and the pattern formation region is cured, the first light is applied to the light irradiation region through an aperture shielding light applied to other than the light irradiation region, and when the resist filled in the template pattern is cured, the second light is applied onto the template without interposition of the aperture. 
     
     
         34 . The method of manufacturing a semiconductor device according to  claim 30 , wherein when the resist which is near the boundary between the outermost peripheral region and the pattern formation region is cured, the first light is applied from a first light irradiation unit, irradiating the first light, to the light irradiation region, and when the resist filled in the template pattern is cured, the second light is applied from a second light irradiation unit, irradiating the second light, onto the template.