Diamond bonded construction with reattached diamond body
Abstract
Diamond bonded construction comprise a diamond body attached to a support. In one embodiment, an initial substrate used to sinter the body is interposed between the body and support, and is thinned to less than 5 times the body thickness, or to less than the body thickness, prior to attachment to the support to relieve stress in the body. In another embodiment, the substrate is removed after sintering, and the body is attached to the support. The support has a material construction different from that of the initial substrate, wherein the initial substrate is selected for infiltration and the support for end use properties. The substrate and support include a hard material with a volume content that may be the same or different. Interfaces between the body, substrate, and/or support may be nonplanar. The body may be thermally stable, and may include a replacement material disposed therein.
Claims
exact text as granted — not AI-modifiedWhat is claimed:
1 . A diamond bonded construction comprising:
a diamond body comprising a matrix phase of intercrystalline bonded diamond and a plurality of interstitial regions dispersed within the matrix phase, wherein the interstitial regions are substantially free of a catalyst material used to sinter the diamond body at high pressure-high temperature conditions; and a support joined to the diamond body and comprising a constituent that has infiltrated from the support into a region of the diamond body to fill a population of the interstitial regions.
2 . The diamond bonded construction as recited in claim 1 wherein the support comprises a material selected from the group consisting of synthetic diamond, natural diamond, WC, W 2 C, TiC, VC, Co, Ni, Fe, Cu, Group VIII materials, and combinations thereof
3 . The diamond bonded construction as recited in claim 2 wherein the support comprises synthetic diamond or natural diamond.
4 . The diamond bonded construction as recited in claim 1 wherein the diamond body comprises a first region adjacent a top surface of the diamond body, and a second region adjacent the substrate, wherein the interstitial regions in the first region are substantially empty.
5 . The diamond bonded construction as recited in claim 4 wherein the interstitial regions in the diamond body second region contain a constituent of the support.
6 . The diamond bonded construction as recited in claim 5 wherein the constituent disposed within the interstitial regions in the diamond body second region comprises diamond.
7 . A bit for drilling subterranean formations comprising a body and a number of cutting elements operatively attached thereto, wherein one or more of the cutting elements comprises the diamond bonded construction of claim 1 .
8 . A diamond bonded construction comprising:
a diamond body comprising a matrix phase of intercrystalline bonded diamond and a plurality of interstitial regions dispersed within the matrix phase, wherein interstitial regions are substantially free of a catalyst material used to sinter the diamond body at high pressure-high temperature conditions; and a support joined to the diamond body and comprising synthetic or natural diamond as combined with a material selected from the group consisting of WC, W 2 C, TiC, VC, Co, Ni, Fe, Cu, Group VIII materials, and combinations thereof.
9 . The diamond bonded construction as recited in claim 8 wherein a population of the interstitial regions is filled with an infiltrant material.
10 . The diamond bonded construction as recited in claim 9 wherein the infiltrant material is a constituent of the support.
11 . The diamond bonded construction as recited in claim 10 wherein the infiltrant material comprises diamond.
12 . The diamond bonded construction as recited in claim 11 wherein the population of interstitial regions filled with the infiltrant material extends within the diamond body from a surface of the diamond body in contact with the support.
13 . The diamond bonded construction as recited in claim 9 wherein the diamond body comprises a first region comprising interstitial regions that are empty and disposed adjacent a diamond body top surface, and a second region comprising the interstitial regions filled with the infiltrant material and disposed adjacent the support.
14 . A bit for drilling subterranean formations comprising a body and a number of cutting elements operatively attached thereto, wherein one or more of the cutting elements comprises the diamond bonded construction of claim 8 .
15 . A diamond bonded construction comprising:
a diamond body comprising a matrix phase of intercrystalline bonded diamond and a plurality of interstitial regions dispersed within the matrix phase, wherein the interstitial regions are substantially free of a catalyst material used to sinter the diamond body at high pressure-high temperature conditions; and a support joined to the diamond body formed from a material selected from the group consisting of synthetic diamond, natural diamond, WC, W 2 C, TiC, VC, Co, Ni, Fe, Cu, Group VIII materials, and combination thereof; wherein the diamond body comprises a first region with interstitial regions that are substantially empty and a second region that includes an infiltrant material.
16 . The diamond bonded construction as recited in claim 10 wherein the infiltrant material is diamond.
17 . The diamond bonded construction as recited in claim 10 wherein the support comprises synthetic or natural diamond.
18 . The diamond bonded construction as recited in claim 10 wherein the second region is adjacent the support and the first region is adjacent a top surface of the diamond body.
19 . The diamond bonded construction as recited in claim 15 wherein an interface between the diamond body and the support is nonplanar.
20 . A bit for drilling subterranean formations comprising a body and a number of cutting elements operatively attached thereto, wherein one or more of the cutting elements comprises the diamond bonded construction of claim 15 .Join the waitlist — get patent alerts
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