Processing System

Abstract

A processing system for processing an object ( 3 ) is provided, wherein the processing system is adapted, to focus a first energy beam, in particular an electron beam ( 11 ), and a second energy beam, in particular an ion beam ( 21 ), on a focusing region ( 29 ) in which a object ( 3 ) to be processed is arrangeable. A processing chamber wall ( 35 ) having two openings ( 38, 39 ) for traversal of both energy beams and a connector ( 37 ) for supplying process gas delimits a processing chamber ( 45 ) from a vacuum chamber ( 2 ) of the processing system. Processing the object by activating the process gas through one of the energy beams and inspecting the object via one of the energy beams is enabled for different orientations of the object relative to a propagation direction of one of the energy beams.

1 - 14 . (canceled) 
     
     
         15 . A processing system for processing at least a portion of an object piece, the processing system comprising:
 a first energy beam guiding system for generating a first energy beam and a second energy beam guiding system for generating a second energy beam;   a processing chamber, which is located within the vacuum chamber, wherein the object piece is contained within the processing chamber;   wherein the processing system is configured to introduce the first energy beam and the second energy beam into the processing chamber.   
     
     
         16 . The processing system of  claim 15 , wherein the processing chamber wall has a first entry configured to allow the first energy beam to enter the processing chamber and a second entry configured to allow the second energy beam to enter the processing chamber. 
     
     
         17 . The processing chamber of  claim 16 , wherein at least one of the first entry and the second entry comprises an opening. 
     
     
         18 . The processing system of  claim 15 , wherein the first energy beam or the second energy beam comprises a photon energy beam. 
     
     
         19 . The processing system of  claim 15 , wherein a beam axis of the first energy beam guiding system and a beam axis of the second energy beam guiding system include an angle which is greater than 10 degrees. 
     
     
         20 . The processing system of  claim 15 , wherein a partial pressure of the process gas within the process chamber is higher than in the vacuum chamber. 
     
     
         21 . A processing system for processing at least a portion of an object piece, the processing system comprising:
 a first energy beam guiding system for generating the first energy beam and a second energy beam guiding system for generating the second energy beam;   a processing chamber, which is located within the vacuum chamber, the processing chamber having a processing chamber wall; wherein the object piece is contained within the processing chamber; and   an object holder configured to change an orientation of the object piece, measured relative to a beam path of the first energy beam, from a first orientation to a second orientation;   wherein the processing system is configured such that in the first orientation, the beam path of the first energy beam extends into the processing chamber and in the second orientation, a beam path of the second energy beam extends into the processing chamber.   
     
     
         22 . The processing system of  claim 21 ,
 wherein the processing chamber has a processing chamber wall; and   wherein the processing system comprises an object holder for changing at least one of a position and an orientation of the object piece;   wherein the processing chamber wall contacts the object holder when the first energy beam is introduced into the processing chamber and when the second energy beam is introduced into the processing chamber.   
     
     
         23 . The processing system of  claim 22 , wherein the processing chamber wall lies flush against the object holder when the first energy beam is introduced into the processing chamber and when the second energy beam is introduced into the processing chamber. 
     
     
         24 . The processing system of  claim 22 , wherein a rigid surface of the processing chamber wall lies flush against a rigid surface of the object holder when the first energy beam is introduced into the processing chamber and when the second energy beam is introduced into the processing chamber. 
     
     
         25 . The processing system of  claim 21 , wherein in the first orientation and in the second orientation, a partial pressure of the process gas within the process chamber is higher than in the vacuum chamber. 
     
     
         26 . The processing system of  claim 21 , wherein an angle between the first orientation and the second orientation is within a range of between 10 and 75 degrees. 
     
     
         27 . The processing system of  claim 21 , wherein the first energy beam or the second energy beam comprises a photon energy beam. 
     
     
         28 . The processing system of  claim 21 , wherein a beam axis of the first energy beam guiding system and a beam axis of the second energy beam guiding system include an angle which is greater than 10 degrees.