Chemical plating product and method forming thereof

Abstract

The invention discloses a chemical plating product and method forming thereof, the chemical plating product includes an insulating member ( 1 ) and a metal coating covering the insulating member ( 1 ), the metal coating includes a pre-plating scope ( 2 ) formed by a coating catalyst and a chemical copper layer ( 3 ) covering the pre-plating scope ( 2 ).

What is claimed is: 
     
         1 . A chemical plating product formed by chemical method, comprising:
 an insulating member; and   a metal coating covering the insulative housing, the metal coating including a pre-plating scope formed by a coating catalyst and a chemical copper layer covering the pre-plating scope.   
     
     
         2 . The chemical plating product as claimed in  claim 1 , wherein at least the pre-plating scope of the insulating member is chemical demoulded and is made coarse. 
     
     
         3 . The chemical plating product as claimed in  claim 2 , wherein chemical plating nickel and gold on the chemical copper layer. 
     
     
         4 . The chemical plating product as claimed in  claim 2 , wherein electro plating copper, nickel and gold on the chemical copper layer. 
     
     
         5 . The chemical plating product as claimed in  claim 2 , wherein electro plating copper and nickel on the chemical copper layer. 
     
     
         6 . The chemical plating product as claimed in  claim 5 , wherein electro plating black nickel on the electro plating nickel. 
     
     
         7 . The chemical plating product as claimed in  claim 1 , wherein the coating catalyst is a planar shaped organic nanopalladium metal conductive layer. 
     
     
         8 . The chemical plating product as claimed in  claim 1 , wherein the coating catalyst is a stereo shaped nanopalladium metal conductive layer. 
     
     
         9 . A method for forming a chemical plating product, including:
 (a). providing an insulating member;   (b). putting the insulating member into chemical solution to make it being chemical demoulded, and then make the surface of the insulating member coarse;   (c). plating the insulating member to confirm the pre-plating scope by coating catalyst;   (d). chemical-plating copper on the pre-plating scope.   
     
     
         10 . The method for forming a chemical plating product as claimed in  claim 9 , wherein the coating catalyst in step (c) is a planar shaped organic nanopalladium metal conductive layer. 
     
     
         11 . The method for forming a chemical plating product as claimed in  claim 9 , wherein the coating catalyst in step (c) is a stereo shaped nanopalladium metal conductive layer. 
     
     
         12 . The method for forming a chemical plating product as claimed in  claim 10 , wherein chemical plating copper, nickel and gold on the basis of step (d). 
     
     
         13 . The method for forming a chemical plating product as claimed in  claim 10 , wherein electro plating copper and nickel on the basis of step (d). 
     
     
         14 . The method for forming a chemical plating product as claimed in  claim 13 , wherein electro plating black nickel on the electro plating nickel layer. 
     
     
         15 . The method for forming a chemical plating product as claimed in  claim 13 , wherein electro plating gold the electro plating nickel layer. 
     
     
         16 . A chemical plating product comprising:
 an insulating member;   a coarse surface formed on the insulating member;   a catalyst layer coated upon a selected area of the coarse surface; and   a chemical copper layer covering the catalyst layer and no chemical copper layer is formed on other non-selected area of the coarse surface.   
     
     
         17 . The chemical plating product as claimed in  claim 16 , further including a layers of gold, nickel and copper on the chemical copper layer.