US2015102488A1PendingUtilityA1
Printed circuit board using solder coating ball
Est. expiryAug 6, 2032(~6 yrs left)· nominal 20-yr term from priority
H10W 90/724H10W 72/07254H10W 72/07236H10W 72/252H10W 72/242H10W 72/241H10W 72/222H10W 72/072H10W 70/69H10W 90/701H10W 20/0698H01L 2224/16113H01L 24/16H01L 2224/16227H10W 72/20
50
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Claims
Abstract
Disclosed herein a printed circuit board comprising: a plurality of pads formed on a substrate; a solder resist (SR) pattern enclosing a region of the pad and burying another circuit pattern; and a solder pattern including a metal pattern therein using a solder and formed on an upper surface of each of the pads.
Claims
exact text as granted — not AI-modifiedWhat is claimed is:
1 . A printed circuit board comprising:
a plurality of pads formed on a substrate; a solder resist (SR) pattern enclosing a region of the pad and burying another circuit pattern; and a solder pattern including a metal pattern therein using a solder and formed on an upper surface of each of the pads.
2 . The printed circuit board as set forth in claim 1 , wherein the solder pattern includes a metal pattern made of a conductive metal material in the solder.
3 . The package as set forth in claim 1 , wherein a chip is formed at the same height from an upper surface of the substrate.
4 . The package as set forth in claim 1 , further comprising a post bump between a chip and the solder pattern.
5 . The printed circuit board as set forth in claim 1 , wherein the solder pattern is formed to have a flat upper surface.
6 . The printed circuit board as set forth in claim 1 , wherein the respective cross sections of upper and lower surfaces of the solder pattern are substantially same.Join the waitlist — get patent alerts
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