US2015101192A1PendingUtilityA1

Method of manufacturing ultra thin slab-shaped capillary structure for thermal conduction

Assignee: PAI HAOPriority: Oct 15, 2013Filed: Oct 15, 2013Published: Apr 16, 2015
Est. expiryOct 15, 2033(~7.2 yrs left)· nominal 20-yr term from priority
Inventors:Hao Pai
F28D 15/046Y10T29/49353F28D 15/0233
48
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Claims

Abstract

A method of manufacturing ultra thin slab-shaped capillary structure for thermal conduction includes the steps of preparing a slab-shaped capillary structure, forming narrow and long recessed portions with an interval apart from each other on a surface of the slab-shaped capillary structure by an extrusion method, and arranging the recessed portion along the lengthwise direction of the slab-shaped capillary structure, and installing the slab-shaped capillary structure in a hollow plate-like housing, such that a vapor channel is formed between each recessed portion of the slab-shaped capillary structure and an inner wall of the plate-like housing.

Claims

exact text as granted — not AI-modified
What is claimed is: 
     
         1 . A method of manufacturing ultra thin slab-shaped capillary structure for thermal conduction, comprising:
 (a) preparing a slab-shaped capillary structure;   (b) forming a plurality of narrow and long recessed portions disposed with an interval apart from one another on a surface of the slab-shaped capillary structure by an extrusion method, and the recessed portions being arranged and extended along a lengthwise direction of the slab-shaped capillary structure;   (c) installing the slab-shaped capillary structure of the step (b) into a hollow plate-like housing, such that a vapor channel is formed between each recessed portion of the slab-shaped capillary structure and an inner wall of the plate-like housing.   
     
     
         2 . The method of manufacturing ultra thin slab-shaped capillary structure for thermal conduction according to  claim 1 , wherein the slab-shaped capillary structure of the step (a) is formed by a knitted fabric, a fiber, a metal powder sintering, or a combination thereof. 
     
     
         3 . The method of manufacturing ultra thin slab-shaped capillary structure for thermal conduction according to  claim 1 , wherein the extrusion method of the step (b) extrudes the surface of the slab-shaped capillary structure by a mold. 
     
     
         4 . The method of manufacturing ultra thin slab-shaped capillary structure for thermal conduction according to  claim 3 , wherein the mold has an extruded surface opposite to the surface of the slab-shaped capillary structure, and the extruded surface has a plurality of narrow and long protrusions arranged with an interval apart from one another, and a flat portion is provided for separating each of the protrusions. 
     
     
         5 . The method of manufacturing ultra thin slab-shaped capillary structure for thermal conduction according to  claim 4 , wherein each recessed portion of the slab-shaped capillary structure is extruded into a V-shape, an arc shape, a rectangular shape or a trapezium shape. 
     
     
         6 . The method of manufacturing ultra thin slab-shaped capillary structure for thermal conduction according to  claim 5 , wherein the slab-shaped capillary structure has a partial hollow area punched and formed thereon. 
     
     
         7 . The method of manufacturing ultra thin slab-shaped capillary structure for thermal conduction according to  claim 5 , wherein each recessed portion of the slab-shaped capillary structure has a penetrating hole punched and formed thereon. 
     
     
         8 . The method of manufacturing ultra thin slab-shaped capillary structure for thermal conduction according to  claim 5 , further comprising a plurality of recesses extruded between the recessed portions of the slab-shaped capillary structure. 
     
     
         9 . The method of manufacturing ultra thin slab-shaped capillary structure for thermal conduction according to  claim 1 , wherein the plate-like housing of the step (c) is formed by engaging a lower casing and an upper casing with each other vertically. 
     
     
         10 . The method of manufacturing ultra thin slab-shaped capillary structure for thermal conduction according to  claim 9 , wherein the lower casing of the plate-like housing is extruded together with the slab-shaped capillary structure in the step (b). 
     
     
         11 . The method of manufacturing ultra thin slab-shaped capillary structure for thermal conduction according to  claim 1 , wherein the plate-like housing of the step (c) is formed by pressing a circular hollow tubular member. 
     
     
         12 . The method of manufacturing ultra thin slab-shaped capillary structure for thermal conduction according to  claim 1 , wherein the extruded slab-shaped capillary structure of the step (c) has a thickness below 0.1 mm.

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