Method of manufacturing ultra thin slab-shaped capillary structure for thermal conduction
Abstract
A method of manufacturing ultra thin slab-shaped capillary structure for thermal conduction includes the steps of preparing a slab-shaped capillary structure, forming narrow and long recessed portions with an interval apart from each other on a surface of the slab-shaped capillary structure by an extrusion method, and arranging the recessed portion along the lengthwise direction of the slab-shaped capillary structure, and installing the slab-shaped capillary structure in a hollow plate-like housing, such that a vapor channel is formed between each recessed portion of the slab-shaped capillary structure and an inner wall of the plate-like housing.
Claims
exact text as granted — not AI-modifiedWhat is claimed is:
1 . A method of manufacturing ultra thin slab-shaped capillary structure for thermal conduction, comprising:
(a) preparing a slab-shaped capillary structure; (b) forming a plurality of narrow and long recessed portions disposed with an interval apart from one another on a surface of the slab-shaped capillary structure by an extrusion method, and the recessed portions being arranged and extended along a lengthwise direction of the slab-shaped capillary structure; (c) installing the slab-shaped capillary structure of the step (b) into a hollow plate-like housing, such that a vapor channel is formed between each recessed portion of the slab-shaped capillary structure and an inner wall of the plate-like housing.
2 . The method of manufacturing ultra thin slab-shaped capillary structure for thermal conduction according to claim 1 , wherein the slab-shaped capillary structure of the step (a) is formed by a knitted fabric, a fiber, a metal powder sintering, or a combination thereof.
3 . The method of manufacturing ultra thin slab-shaped capillary structure for thermal conduction according to claim 1 , wherein the extrusion method of the step (b) extrudes the surface of the slab-shaped capillary structure by a mold.
4 . The method of manufacturing ultra thin slab-shaped capillary structure for thermal conduction according to claim 3 , wherein the mold has an extruded surface opposite to the surface of the slab-shaped capillary structure, and the extruded surface has a plurality of narrow and long protrusions arranged with an interval apart from one another, and a flat portion is provided for separating each of the protrusions.
5 . The method of manufacturing ultra thin slab-shaped capillary structure for thermal conduction according to claim 4 , wherein each recessed portion of the slab-shaped capillary structure is extruded into a V-shape, an arc shape, a rectangular shape or a trapezium shape.
6 . The method of manufacturing ultra thin slab-shaped capillary structure for thermal conduction according to claim 5 , wherein the slab-shaped capillary structure has a partial hollow area punched and formed thereon.
7 . The method of manufacturing ultra thin slab-shaped capillary structure for thermal conduction according to claim 5 , wherein each recessed portion of the slab-shaped capillary structure has a penetrating hole punched and formed thereon.
8 . The method of manufacturing ultra thin slab-shaped capillary structure for thermal conduction according to claim 5 , further comprising a plurality of recesses extruded between the recessed portions of the slab-shaped capillary structure.
9 . The method of manufacturing ultra thin slab-shaped capillary structure for thermal conduction according to claim 1 , wherein the plate-like housing of the step (c) is formed by engaging a lower casing and an upper casing with each other vertically.
10 . The method of manufacturing ultra thin slab-shaped capillary structure for thermal conduction according to claim 9 , wherein the lower casing of the plate-like housing is extruded together with the slab-shaped capillary structure in the step (b).
11 . The method of manufacturing ultra thin slab-shaped capillary structure for thermal conduction according to claim 1 , wherein the plate-like housing of the step (c) is formed by pressing a circular hollow tubular member.
12 . The method of manufacturing ultra thin slab-shaped capillary structure for thermal conduction according to claim 1 , wherein the extruded slab-shaped capillary structure of the step (c) has a thickness below 0.1 mm.Join the waitlist — get patent alerts
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