Plating apparatus and cleaning device used in the plating apparatus

Abstract

A plating apparatus for plating a substrate is disclosed. The plating apparatus includes: a dip-type plating bath; a dry-type plating bath having a hole in a sidewall thereof; and a pressing mechanism configured to press a substrate holder, holding a substrate, against the sidewall of the dry-type plating bath to close the hole. The substrate holder includes a base member and a holding member configured to sandwich the substrate therebetween, a first seal portion configured to seal a gap between the substrate and the holding member, a second seal portion configured to seal a gap between the base member and the holding member, and a third seal portion configured to seal a gap between the holding member and the sidewall of the dry-type plating bath.

What is claimed is: 
     
         1 . A plating apparatus for plating a substrate, comprising:
 a substrate holder configured to hold the substrate;   a dip-type plating bath configured to hold a first plating solution in which the substrate holder holding the substrate is immersed;   a dry-type plating bath having a hole in a sidewall thereof and configured to hold a second plating solution;   a transporter configured to transport the substrate holder to the dip-type plating bath and to a predetermined position beside the sidewall of the dry-type plating bath; and   a pressing mechanism configured to press the substrate holder, holding the substrate, against the sidewall of the dry-type plating bath to thereby close the hole with the substrate holder holding the substrate,   wherein the substrate holder includes a base member and a holding member configured to sandwich the substrate therebetween, a first seal portion configured to seal a gap between the substrate and the holding member, a second seal portion configured to seal a gap between the base member and the holding member, and a third seal portion configured to seal a gap between the holding member and the sidewall of the dry-type plating bath.   
     
     
         2 . The plating apparatus according to  claim 1 , further comprising an electrical contact electrically connected to a plating power source,
 wherein the substrate holder includes a feeding terminal to be electrically connected to the substrate, and   wherein the pressing mechanism is configured to press the substrate holder, holding the substrate, against the sidewall of the dry-type plating bath to close the hole with the substrate holder holding the substrate while pressing the feeding terminal against the electrical contact.   
     
     
         3 . The plating apparatus according to  claim 1 , wherein:
 the substrate holder includes a projecting surface projecting in a normal direction of the substrate, and a stepped portion provided outside of the projecting surface; and   the third seal portion is provided on the stepped portion so that the third seal portion is pressed against the sidewall by the pressing mechanism.   
     
     
         4 . The plating apparatus according to  claim 3 , wherein the projecting surface of the substrate holder lies in the same plane as an inner surface of the sidewall when the substrate holder is pressed against the sidewall. 
     
     
         5 . The plating apparatus according to  claim 1 , wherein the first seal portion, the second seal portion, and the third seal portion are formed from a single seal member. 
     
     
         6 . The plating apparatus according to  claim 1 , wherein:
 the dry-type plating bath has an electrolyte chamber configured to hold an electrolyte, and a partition configured to isolate the second plating solution from the electrolyte; and   an anode is disposed in the electrolyte chamber.   
     
     
         7 . The plating apparatus according to  claim 1 , further comprising a cleaning device configured to clean the sidewall of the dry-type plating bath,
 wherein the cleaning device has substantially the same shape and size as those of the substrate holder, and   wherein the transporter is configured to transport the cleaning device to the predetermined position beside the sidewall of the dry-type plating bath.   
     
     
         8 . The plating apparatus according to  claim 7 , wherein the cleaning device includes a cleaning element configured to contact the sidewall of the dry-type plating bath, and a rotating mechanism configured to rotate the cleaning element on the sidewall. 
     
     
         9 . The plating apparatus according to  claim 8 , further comprising a cleaning nozzle configured to supply a cleaning liquid to the cleaning element. 
     
     
         10 . The plating apparatus according to  claim 1 , wherein the second plating solution comprises a gold plating solution. 
     
     
         11 . A cleaning device for use in a plating apparatus that includes
 (i) a substrate holder configured to hold a substrate,   (ii) a dry-type plating bath having a hole in a sidewall thereof and configured to hold a plating solution, and   (iii) a pressing mechanism configured to press the substrate holder, holding the substrate, against the sidewall of the dry-type plating bath to thereby close the hole with the substrate holder holding the substrate,   the cleaning device comprising:   a cleaning element configured to contact the sidewall of the dry-type plating bath; and   a rotating mechanism configured to rotate the cleaning element on the sidewall of the dry-type plating bath,   wherein the cleaning device has substantially the same shape and size as those of the substrate holder.   
     
     
         12 . The cleaning device according to  claim 11 , further comprising a cleaning nozzle configured to supply a cleaning liquid to the cleaning element.