Treatment cup cleaning method, substrate treatment method, and substrate treatment apparatus

Abstract

A treatment cup cleaning method is provided, which includes: a rotating step of rotating a substrate rotating unit with a substrate being held by the substrate rotating unit; a cleaning liquid supplying step of supplying a cleaning liquid to an upper surface and a lower surface of the substrate and causing the cleaning liquid to scatter from a peripheral edge of the substrate to be applied to an inner wall of a treatment cup in the rotating step, whereby the cleaning liquid is supplied to the inner wall of the treatment cup; and a scattering direction changing step of changing a cleaning liquid scattering direction in which the cleaning liquid scatters from the peripheral edge of the substrate in the rotating step and the cleaning liquid supplying step.

What is claimed is: 
     
         1 . A treatment cup cleaning method for cleaning a treatment cup which has an inner wall surrounding a substrate rotating unit and captures a treatment liquid scattering from a substrate horizontally held and rotated about a predetermined rotation axis by the substrate rotating unit, the method comprising:
 a rotating step of rotating the substrate rotating unit with a substrate being held by the substrate rotating unit;   a cleaning liquid supplying step of supplying a cleaning liquid to an upper surface and a lower surface of the substrate and causing the cleaning liquid to scatter from a peripheral edge of the substrate to be applied to the inner wall of the treatment cup in the rotating step, whereby the cleaning liquid is supplied to the inner wall of the treatment cup; and   a scattering direction changing step of changing a cleaning liquid scattering direction in which the cleaning liquid scatters from the peripheral edge of the substrate in the rotating step and the cleaning liquid supplying step.   
     
     
         2 . The treatment cup cleaning method according to  claim 1 , wherein the scattering direction changing step includes a flow rate ratio changing step of changing a flow rate ratio between a flow rate of the cleaning liquid being supplied to the upper surface of the substrate and a flow rate of the cleaning liquid being supplied to the lower surface of the substrate. 
     
     
         3 . The treatment cup cleaning method according to  claim 1 , wherein the scattering direction changing step includes a working speed changing step of changing a working speed of the rotation of the substrate rotating unit. 
     
     
         4 . The treatment cup cleaning method according to  claim 1 , wherein the substrate supplied the cleaning liquid in the cleaning liquid supplying step is a substrate subjected to a predetermined treatment. 
     
     
         5 . The treatment cup cleaning method according to  claim 1 , wherein the substrate supplied the cleaning liquid in the cleaning liquid supplying step is a dummy substrate. 
     
     
         6 . A substrate treatment method comprising:
 a substrate rotating step of rotating a substrate horizontally held by a substrate rotating unit; and   a treatment liquid supplying step of supplying a treatment liquid to an upper surface and a lower surface of the substrate in the substrate rotating step;   wherein the treatment liquid scatters from a peripheral edge of the substrate and is captured by an inner wall of a treatment cup surrounding the substrate rotating unit to be supplied to the inner wall in the treatment liquid supplying step, whereby the inner wall is cleaned with the treatment liquid supplied thereto;   the substrate treatment method further comprising a scattering direction changing step of changing a treatment liquid scattering direction in which the treatment liquid scatters from the peripheral edge of the substrate in the substrate rotating step and the treatment liquid supplying step.   
     
     
         7 . A substrate treatment apparatus comprising:
 a substrate rotating unit which horizontally holds and rotates a substrate about a predetermined rotation axis;   a treatment liquid supplying unit which supplies a treatment liquid to the substrate being rotated by the substrate rotating unit;   a treatment cup which has an inner wall surrounding the substrate rotating unit and captures treatment liquid scattering from the substrate held by the substrate rotating unit;   an upper surface cleaning liquid supplying unit which supplies a cleaning liquid to an upper surface of a substrate being rotated by the substrate rotating unit;   a lower surface cleaning liquid supplying unit which supplies the cleaning liquid to a lower surface of the substrate being rotated by the substrate rotating unit;   a cleaning liquid flow rate ratio adjusting unit which adjusts a flow rate ratio between a flow rate of the cleaning liquid being supplied from the upper surface cleaning liquid supplying unit and a flow rate of the cleaning liquid being supplied from the lower surface cleaning liquid supplying unit;   a cleaning liquid supply controlling unit which controls the substrate rotating unit to rotate the substrate held by the substrate rotating unit, and controls the upper surface cleaning liquid supplying unit and the lower surface cleaning liquid supplying unit to supply the cleaning liquid to the upper surface and the lower surface of the substrate so that the cleaning liquid scatters from a peripheral edge of the substrate to be applied to the inner wall of the treatment cup, whereby the cleaning liquid is supplied to the inner wall of the treatment cup; and   a scattering direction change controlling unit which controls at least one of a rotation speed of the substrate rotating unit and the cleaning liquid flow rate ratio adjusting unit to change a cleaning liquid scattering direction in which the cleaning liquid scatters from the peripheral edge of the substrate.   
     
     
         8 . The substrate treatment apparatus according to  claim 7 , wherein the substrate rotating unit includes a rotary base which is rotatable about the rotation axis, and a plurality of substrate holding members provided on a peripheral portion of the rotary base for holding the substrate in abutment against a peripheral surface of the substrate. 
     
     
         9 . The substrate treatment apparatus according to  claim 8 , wherein the substrate holding members each include a clamping portion defined by a first abutment surface to be brought into abutment against a lower surface peripheral edge of the substrate and a second abutment surface to be brought into abutment against an upper surface peripheral edge of the substrate,
 wherein the first abutment surface is inclined upward radially outward of the substrate with respect to a horizontal plane,   wherein the second abutment surface is inclined downward radially outward of the substrate with respect to the horizontal plane.   
     
     
         10 . The substrate treatment apparatus according to  claim 7 , wherein the treatment liquid supplying unit includes:
 an upper surface treatment liquid supplying unit which supplies the treatment liquid to the upper surface of the substrate being rotated by the substrate rotating unit; and   a lower surface treatment liquid supplying unit which supplies the treatment liquid to the lower surface of the substrate being rotated by the substrate rotating unit;   wherein the upper surface treatment liquid supplying unit doubles as the upper surface cleaning liquid supplying unit;   wherein the lower surface treatment liquid supplying unit doubles as the lower surface cleaning liquid supplying unit.   
     
     
         11 . The substrate treatment apparatus according to  claim 7 , wherein the substrate supplied the cleaning liquid by the upper surface cleaning liquid supplying unit and the lower surface cleaning liquid supplying unit is a substrate subjected to a predetermined treatment. 
     
     
         12 . The substrate treatment apparatus according to  claim 7 , wherein the substrate supplied the cleaning liquid by the upper surface cleaning liquid supplying unit and the lower surface cleaning liquid supplying unit is a dummy substrate.