US2015088084A1PendingUtilityA1
Absorbent structure having three-dimensional topography and method of making same
Est. expiryJun 13, 2023(expired)· nominal 20-yr term from priority
A61F 13/15707A61F 13/533A61F 2013/530437A61F 13/53A61F 13/15B29K 2105/04B29C 2043/463B29C 43/24B29C 43/222A61F 2013/530868A61F 2013/15715Y10T428/24719Y10T428/24702Y10T428/24727Y10T428/24686Y10T428/24694Y10T428/24711A61F 13/15731Y10T428/24669Y10T428/24479Y10T428/24678Y10T442/652Y10T442/60
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Claims
Abstract
A method of making an absorbent structure having a three-dimensional topography includes placing at least a portion of the absorbent structure between opposed mold surfaces. At least one of the mold surfaces has a three-dimensional topography. The three-dimensional topography of the mold surface is imparted onto the absorbent structure so that the absorbent structure has a three-dimensional topography corresponding to the three-dimensional topography of the mold surface.
Claims
exact text as granted — not AI-modifiedWhat is claimed is:
1 . A method of making an absorbent structure having a three-dimensional topography comprises:
passing the absorbent structure through a nip defined by opposed rolls, at least one of the rolls having a mold surface with a three-dimensional topography; and imparting the three-dimensional topography of the mold surface onto the absorbent structure so that the absorbent structure has a three-dimensional topography corresponding to the three-dimensional topography of the mold surface, the three-dimensional topography imparted onto the absorbent structure comprising a plurality of discrete peaks surrounded by interconnected valleys.
2 . The method of claim 1 wherein each of the rolls has a mold surface with a three-dimensional topography to impart a three-dimensional topography on both upper and lower surfaces of the absorbent structure.
3 . The method of claim 2 wherein one of the opposed rolls comprise a first mold surface having a plurality of bumps and the other roll comprises a second mold surface having a plurality of depressions, each of the depressions in the second mold surface being suitably sized and shaped to receive a respective one of the bumps of the first mold surface.
4 . The method of claim 1 wherein imparting the three-dimensional topography of the mold surface onto the absorbent structure comprises compressing the absorbent structure between the opposed rolls.
5 . The method of claim 1 further comprising forming the absorbent structure from absorbent fibers and a binder material using an airlaying technique.
6 . The method of claim 5 wherein the binder material is heat activatable binder material.
7 . The method of claim 6 further comprising heating the absorbent structure to a temperature sufficient to activate the heat activatable binder material.
8 . An absorbent structure having a longitudinal axis, a lateral axis and a z-direction axis normal to the longitudinal and lateral axes, the absorbent structure comprising longitudinally opposite ends, laterally opposite side edges, an upper surface, and a lower surface, the upper surface having a three-dimensional topography relative to the longitudinal and lateral axes and defining a plurality of discrete peaks and interconnected valleys of the upper surface relative to the z-direction.
9 . The absorbent structure as set forth in claim 8 wherein the lower surface has a three-dimensional topography relative to the longitudinal and lateral axes and defining a plurality of the discrete peaks and interconnected valleys of the lower surface relative to the z-direction.
10 . The absorbent structure as set forth in claim 8 wherein the plurality of discrete peaks have a height in the range of about 1 mm and about 5 mm.
11 . The absorbent structure as set forth in claim 8 further comprising a projected area as determined by a Topography Analysis Method, the upper surface of the absorbent structure having a vertical area as determined by the Topography Analysis Method in the range of about 0.1 cm 2 to about 0.5 cm 2 per 1.0 cm 2 projected area of the absorbent structure.Join the waitlist — get patent alerts
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