Cmp conditioner pads with superabrasive grit enhancement

Abstract

A pad conditioner for a CMP polishing pad. The pad conditioner includes a features having textured or roughened surfaces, with superabrasive grit seeds such as diamond interspersed on the roughened surface. A coating such as polycrystalline diamond can be applied over the surfaces and the grit seeds. In one embodiment, the coating has a thickness that is in the range of 50% to 100% of the larger superabrasive grit.

1 . A chemical mechanical polishing pad conditioner, comprising:
 a substrate including a front surface having a plurality of protrusions integral therewith, said plurality of protrusions extending in a frontal direction that is substantially normal to said front surface, each of said plurality of protrusions including a distal extremity, each of said plurality of protrusions having a root-mean-square surface roughness that is greater than 3 μm;   a dispersion of superabrasive grit seeds disposed on said substrate, the dispersion on the protrusions and intermediate the protrusions; and   a diamond coating that covers said substrate, said protrusions and said dispersion of superabrasive grit seeds.   
     
     
         2 . (canceled) 
     
     
         3 . The chemical mechanical polishing pad conditioner of  claim 1 , wherein the protrusions of the substrate have a matrixical arrangement, the projections each having a highest most peak, and each highest most peak positioned on its respective projection in a non repeating fashion with respect to the other projections. 
     
     
         4 . The chemical mechanical polishing pad conditioner of  claim 1  wherein the protrusions of the substrate have repeating spacing pattern providing a density, the density being 0.5 to 5 projections per square mm. 
     
     
         5 . The chemical mechanical, polishing pad conditioner of  claim 1 , wherein the protrusions of the substrate have a matrixical arrangement of projections of a first height and a matrixical arrangement of projections of a different height. 
     
     
         6 . The chemical mechanical polishing pad conditioner of  claim 5  wherein the roughness of the polycrystalline diamond coating is about 0.1 micron to about 2 microns. 
     
     
         7 . The chemical mechanical polishing pad conditioner of  claim 1 , wherein said plurality of superabrasive diamond grit seeds have diameters that range from about 1 μm to about 15 μm. 
     
     
         8 . The chemical mechanical polishing pad conditioner of  claim 1 , wherein said plurality of superabrasive diamond grit seeds have diameters that range from about 1 μm to about 15 μm and said coating has a thickness that is in the range of 50% to 100% of an average diameter of said superabrasive grit seeds. 
     
     
         9 . The chemical mechanical polishing pad conditioner of  claim 1 , wherein the diamond coating has a Root Mean Square roughness of about 0.1 micron to 2 microns 
     
     
         10 . The chemical mechanical polishing pad conditioner of  claim 7 , further comprising a second plurality of superabrasive grit seeds disposed on said surfaces of said substrate and said protrusions, said second plurality of superabrasive grit seeds having diameters that range from about 1 nm to about 30 nm. 
     
     
         11 . The chemical mechanical polishing pad conditioner of  claim 4 , wherein said substrate and said protrusions are of a silicon carbide material. 
     
     
         12 . The chemical mechanical polishing pad conditioner of  claim 11  wherein the substrate is mounted on a base disc and there are at least 4 additional like substrates on said base disc. 
     
     
         13 . The chemical mechanical polishing pad conditioner of  claim 1  wherein the diamond coating is a polycrystalline diamond coating average thickness of about 7 to 15 microns. 
     
     
         14 - 24 . (canceled) 
     
     
         25 . A chemical mechanical polishing pad conditioner, comprising:
 a substrate including a front surface having a plurality of protrusions integral therewith extending from a substrate floor, said plurality of protrusions extending in a frontal direction that is substantially normal to said front surface, said plurality of protrusions arranged in a repeating spacing pattern, said protrusions having an average height measured from the substrate floor level of 10 to 150 microns.   a dispersion of superabrasive grit seeds disposed on said substrate including the plurality of protrusions and intermediate the protrusions; and   a diamond coating that covers said substrate including said protrusions and said dispersion of superabrasive diamond grit seeds.   
     
     
         26 . The chemical mechanical polishing pad conditioner of  claim 25 , wherein the protrusions of the substrate have a matrixical arrangement, the projections each having a highest most peak, and each highest most peak positioned on its respective projection in a non repeating fashion with respect to the other projections. 
     
     
         27 . The chemical mechanical polishing pad conditioner of  claim 25  wherein the protrusions of the substrate have repeating spacing pattern providing a density, the density being 0.5 to 5 projections per square mm. 
     
     
         28 . The chemical mechanical polishing pad conditioner of  claim 25 , wherein said plurality of superabrasive diamond grit seeds have diameters that range from about 1 μm to about 15 μm. 
     
     
         29 . The chemical mechanical polishing pad conditioner of  claim 25 , wherein said plurality of superabrasive diamond grit seeds have diameters that range from about 1 μm to about 15 μm and said coating has a thickness that is in the range of 50% to 100% of an average diameter of said superabrasive grit seeds. 
     
     
         30 . The chemical mechanical polishing pad conditioner of  claim 28 , further comprising a second plurality of superabrasive grit seeds disposed on said surfaces of said substrate and said protrusions, said second plurality of superabrasive grit seeds having diameters that range from about 1 nm to about 30 nm. 
     
     
         31 . The chemical mechanical polishing pad conditioner of  claim 25  wherein the substrate is mounted on a base disc and there are at least 4 additional like substrates on said base disc. 
     
     
         32 . The chemical mechanical polishing pad conditioner of  claim 25  wherein the diamond coating is a polycrystalline diamond coating average thickness of about 7 to 15 microns.