Chip Comprising an Integrated Circuit, Fabrication Method and Method for Locally Rendering a Carbonic Layer Conductive

Abstract

A chip includes an integrated circuit and a carbonic layer. The carbonic layer includes a graphite-like carbon, wherein a lateral conducting path through the graphite-like carbon electrically connects two circuit elements of the integrated circuit.

What is claimed is: 
     
         1 . A method for fabricating a chip comprising an integrated circuit, the method comprising:
 heating a carbonic layer to form a conducting portion of the carbonic layer, wherein a lateral path through the conducting portion connects two circuit elements of the integrated circuit.   
     
     
         2 . The method of  claim 1 , further comprising providing the carbonic layer on a substrate. 
     
     
         3 . The method of  claim 2 , wherein providing the carbonic layer is performed such that the carbonic layer comprises amorphous carbon. 
     
     
         4 . The method of  claim 3 , wherein the heating is performed such that amorphous carbon is converted into graphite-like carbon surrounded by amorphous carbon. 
     
     
         5 . The method of  claim 4 , wherein the heating is performed such that amorphous carbon and graphite-like carbon occupy laterally distinct areas of the carbonic layer and both extend over a whole thickness of the carbonic layer. 
     
     
         6 . The method of  claim 5 , wherein the thickness of the carbonic layer is laterally constant. 
     
     
         7 . The method of  claim 4 , wherein the heating is performed such that the graphite-like carbon extends down to a depth of the carbonic layer smaller than a thickness of the carbonic layer and is embedded in the amorphous carbon. 
     
     
         8 . The method of  claim 1 , wherein heating the carbonic layer comprises using a laser. 
     
     
         9 . The method of  claim 1 , wherein heating the carbonic layer comprises using an oven. 
     
     
         10 . The method of  claim 1 , wherein heating the carbonic layer comprises locally heating the carbonic layer. 
     
     
         11 . The method of  claim 10 , wherein locally heating is performed such that the lateral path connects two circuit elements, wherein a first one of the two circuit elements is a transistor or a logical circuit and a second one of the two circuit elements is one of a group consisting of a contact pad, a logical circuit, a transistor, a capacitor and a diode.