US2015087095A1PendingUtilityA1
Encapsulating sheet, light emitting diode device, and producing method thereof
Est. expiryMar 6, 2032(~5.6 yrs left)· nominal 20-yr term from priority
Inventors:Hiroyuki Katayama
H10H 20/0362H10H 20/0361H10H 20/8511H10H 20/854H10H 20/853H10H 20/851H10H 20/01H10H 20/852H10H 20/85H01L 33/50H01L 33/005H01L 2933/0041H01L 2933/005H01L 33/52Y10T428/24521
62
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Claims
Abstract
An encapsulating sheet includes a transparent layer in which a concave portion that is dented from the surface inwardly is formed and a phosphor encapsulating layer which fills the concave portion. The transparent layer is formed from a transparent composition containing a first silicone resin composition and the phosphor encapsulating layer is formed from a phosphor encapsulating composition containing a phosphor and a second silicone resin composition.
Claims
exact text as granted — not AI-modifiedWhat is claimed is:
1 . A method for producing a light emitting diode device, allowing encapsulation of a light emitting diode element by an encapsulating sheet, comprising the steps of:
preparing an encapsulating sheet, wherein the encapsulating sheet comprises
a transparent layer in which a concave portion that is dented from the surface inwardly is formed and
a phosphor encapsulating layer which fills the concave portion, and
the transparent layer is formed from a transparent composition containing a first silicone resin composition and
the phosphor encapsulating layer is formed from a phosphor encapsulating composition containing a phosphor and a second silicone resin composition; and
embedding the light emitting diode element in the phosphor encapsulating layer in the encapsulating sheet.Join the waitlist — get patent alerts
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