Method of manufacturing a component and thermal management process

Abstract

A method of manufacturing a component and a method of thermal management are provided. The methods include forming at least one portion of the component, printing a cooling member of the component and attaching the at least one portion to the cooling member of the component. The cooling member includes at least one cooling feature. The at least one cooling feature includes at least one cooling channel adjacent to a surface of the component, wherein printing allows for near-net shape geometry of the cooling member with the at least one cooling channel being located within a range of about 127 (0.005 inches) to about 762 micrometers (0.030 inches) from the surface of the component. The method of thermal management also includes transporting a fluid through at least one fluid pathway defined by the at least one cooling channel within the component to cool the component.

What is claimed is: 
     
         1 . A method of manufacturing a component comprising:
 forming at least one portion of the component;   printing a cooling member of the component, the cooling member including at least one cooling feature, the at least one cooling feature including at least one cooling channel adjacent to a surface of the component, wherein printing allows for near-net shape geometry of the cooling member with the at least one cooling channel being located within a range of about 127 (0.005 inches) to about 762 micrometers (0.030 inches) from the surface of the component; and   attaching the at least one portion to the cooling member of the component.   
     
     
         2 . The method of  claim 1 , wherein the at least one cooling feature further includes at least one cooling cavity adjacent to the at least one cooling channel. 
     
     
         3 . The method of  claim 2 , wherein the step of printing further includes creating a first opening in the at least one cooling channel, the first opening joining the at least one cooling cavity to the at least one cooling channel. 
     
     
         4 . The method of  claim 3 , wherein the step of printing further includes creating a second opening in the at least one cooling channel, the second opening being in the surface of the component. 
     
     
         5 . The method of  claim 2 , wherein the at least one portion of the component further includes at least one cooling cavity. 
     
     
         6 . The method of  claim 5 , wherein the at least one cooling cavity of the at least one portion aligns with the at least one cooling cavity of the cooling member. 
     
     
         7 . The method of  claim 1 , wherein the step of forming includes casting or three-dimensional printing of the at least one portion. 
     
     
         8 . The method of  claim 1 , wherein the step of printing uses a three-dimensional printing process. 
     
     
         9 . The method of  claim 1 , wherein the step of attaching includes welding, brazing transient liquid phase (TLP) bonding, diffusion bonding, mechanical attachment, or combinations thereof. 
     
     
         10 . The method of  claim 1 , wherein the at least one portion is selected from a first material and the cooling member is selected from a second material. 
     
     
         11 . The method of  claim 10 , wherein the first material is the same as the second material. 
     
     
         12 . The method of  claim 10 , wherein the first material is different than the second material. 
     
     
         13 . The method of  claim 10 , wherein the first material is selected from nickel, iron, cobalt, chromium, molybdenum, aluminum, titanium, stainless steel, nickel based superalloys, cobalt super alloys or combinations thereof. 
     
     
         14 . The method of  claim 10 , wherein the second material is selected from nickel, iron, cobalt, chromium, molybdenum, aluminum, titanium, stainless steel, nickel based superalloys, cobalt super alloys or combinations thereof. 
     
     
         15 . The method of  claim 1 , wherein the at least one cooling channel is located at least less than about 508 micrometers (0.020 inches) away from the surface of the component. 
     
     
         16 . The method of  claim 1 , wherein the at least one cooling channel is located at least less than about 254 micrometers (0.010 inches) away from the surface of the component. 
     
     
         17 . The method of  claim 1 , wherein the at least one cooling channel has a varying geometry throughout the cooling member. 
     
     
         18 . The method of  claim 1 , further comprising applying at least one protective coating after the step of attaching. 
     
     
         19 . A method of thermal management of a component comprising:
 forming at least one portion of the component;   printing a cooling member of the component, the cooling member including at least one cooling feature, the at least one cooling feature including at least one cooling channel adjacent to a surface of the component, wherein printing allows for near-net shape geometry of the cooling member with the at least one cooling channel being located within a range of about 127 (0.005 inches) to about 762 micrometers (0.030 inches) from the surface of the component;   attaching the at least one portion to the cooling member of the component; and   transporting a fluid through at least one fluid pathway defined by the at least one cooling channel within the component to cool the component.   
     
     
         20 . The method of  claim 20 , wherein the at least one cooling channel is located at least less than about 508 micrometers (0.020 inches) away from the surface of the component.