Image pickup module and method for manufacturing image pickup module

Abstract

The present invention achieves reduction in size and thickness while removing the cause of defective image and the like. According to an image pickup module ( 1 ), a solid-state image pickup device ( 3 ) and a flexible substrate ( 2 ) are connected to each other by flip-chip bonding, and an opening ( 5 ) is formed in the flexible substrate 2 by melting the flexible substrate ( 2 ) and an anisotropically-conductive film ( 8 ) adhered to the flexible substrate ( 2 ).

1 . An image pickup module comprising:
 a solid-state image pickup device having a light receiving section and an electrode pad;   a substrate having an opening, a wiring pattern which is connected to the electrode pad by flip-chip bonding being formed on the substrate;   an anisotropically-conductive film which is adhered to the substrate so that the substrate and the solid-state image pickup device are connected to each other via the anisotropically-conductive film; and   a light-transmitting member provided in the opening, the light-transmitting member causing light to pass through so that the light is to be received by the light receiving section,   the opening being formed by melting the substrate and the anisotropically-conductive film, and   at an edge of the opening, the anisotropically-conductive film being hardened while retaining a melted shape which has been formed by the melting.   
     
     
         2 . The image pickup module as set forth in  claim 1 , wherein:
 an outside length on a short side of the solid-state image pickup device is 90% or more of an outside length on a short side of the substrate.   
     
     
         3 . The image pickup module as set forth in  claim 1  or  2   claim 1 , wherein the substrate is a flexible printed circuit board. 
     
     
         4 . The image pickup module as set forth in a wherein an interface between the substrate and the solid-state image pickup device is sealed by resin. 
     
     
         5 . The image pickup module as set forth in  claim 1 , wherein one end of the substrate is extended in one direction, and an external terminal is provided on an extended part of the substrate. 
     
     
         6 . The image pickup module as set forth in  claim 1 , wherein:
 the wiring pattern is formed in a quadrangular region; and   at least two of four corners of the quadrangular region are cut out.   
     
     
         7 . A method for manufacturing an image pickup module in which a solid-state image pickup device having an electrode pad is provided on a substrate on which a wiring pattern is formed, said method comprising the steps of:
 (a) adhering an anisotropically-conductive film to the substrate;   (b) forming an opening by melting a periphery of a part to be cut out of the substrate to which the anisotropically-conductive film has been adhered;   (c) providing a light-transmitting member in the opening; and   (d) connecting, by flip-chip bonding, the wiring pattern of the substrate to the electrode pad of the solid-state image pickup device via a bump such that a light receiving section of the solid-state image pickup device receives light which has passed through the light-transmitting member.   
     
     
         8 . The method as set forth in  claim 7 , further comprising the step of:
 (e) confirming a bump mark on the substrate after the step (d).