Electroplating processor with geometric electrolyte flow path

Abstract

An electroplating processor includes an electrode plate having a continuous flow path formed in a channel. The flow path may optionally be a coiled flow path. One or more electrodes are positioned in the channel. A membrane plate is attached to the electrode plate with a membrane in between them. Electrolyte moves through the flow path at a high velocity, preventing bubbles from sticking to the bottom surface of membrane. Any bubbles in the flow path are entrained in the fast moving electrolyte and carried away from the membrane. The electroplating processor may alternatively have a wire electrode extending through a tubular membrane formed into a coil or other shape, optionally including shapes having straight segments.

1 . An electroplating processor, comprising:
 a vessel;   a tubular membrane in the vessel extending between an inlet and an outlet; and   an electrode wire extending through the tubular membrane.   
     
     
         2 . The electroplating processor of  claim 1  with the tubular membrane having rings formed between a coiled channel wall. 
     
     
         3 . The electroplating processor of  claim 1  with the tubular membrane comprising a spiral. 
     
     
         4 . The electroplating processor of  claim 1  further including a head engageable with the vessel, and with no element between the head and the tubular membrane so that an open space is provided between the tubular membrane and the head. 
     
     
         5 . The electroplating processor of  claim 1  further comprising a membrane plate having a channel, and with the tubular membrane in the channel. 
     
     
         6 . The electroplating processor of  claim 5  with the channel having a rectangular cross section and the tubular membrane having a round cross section. 
     
     
         7 . The electroplating processor of  claim 1  wherein the tubular membrane is a spiral or concentric circles connected by flow segments. 
     
     
         8 . The electroplating processor of  claim 1  wherein the cross section of the tubular membrane adjacent to the outlet is greater than at the inlet. 
     
     
         9 . The electroplating processor of  claim 5  wherein the membrane plate has one or more rings of ribs, and with the coiled support attached to a bottom surface of the ribs. 
     
     
         10 . An electroplating processor, comprising:
 a vessel;   a head engageable with the vessel;   a cathode on the head;   a tubular membrane in the vessel extending between an inlet and an outlet; and   an anode in the tubular membrane.   
     
     
         11 . The electroplating processor of  claim 10  further including a vessel membrane separating an anolyte chamber from a catholyte chamber within the vessel, and with the tubular membrane in the catholyte chamber. 
     
     
         12 . The electroplating processor of  claim 10  with the tubular membrane comprising a spiral. 
     
     
         13 . The electroplating processor of  claim 11  further including a catholyte drain in the catholyte chamber below the tubular membrane. 
     
     
         14 . The electroplating processor of  claim 10  further comprising a membrane plate having a channel, and with the tubular membrane in the channel. 
     
     
         15 . An electroplating processor, comprising:
 a vessel;   a tubular membrane in the vessel between forming a continuous flow path between an inlet and an outlet; and   an electrode wire in the tubular membrane.   
     
     
         16 . The processor of  claim 15  with electrode wire connected to an anode, and a cathode above the tubular membrane.