Superabrasive tools having substantially leveled particle tips and associated methods

Abstract

Superabrasive tools and methods for making and using the same are provided. In one aspect, for example, a CMP pad dresser includes a first monolayer of superabrasive particles disposed on and coupled to one side of a metal support layer and a second monolayer of superabrasive particles disposed on and coupled to the metal support layer on an opposite side from the first monolayer. The superabrasive particles of the second monolayer are positioned to have substantially the same distribution as the superabrasive particles of the first monolayer.

What is claimed is: 
     
         1 . A CMP pad dresser, comprising:
 a first monolayer of superabrasive particles disposed on and coupled to one side of a metal support layer; and   a second monolayer of superabrasive particles disposed on and coupled to the metal support layer on an opposite side from the first monolayer, wherein the superabrasive particles of the second monolayer are positioned to have substantially the same distribution as the superabrasive particles of the first monolayer.   
     
     
         2 . The dresser of  claim 1 , wherein the superabrasive particles in the first monolayer include a member selected from the group consisting of diamond materials, nitride materials, ceramics, or a combination thereof. 
     
     
         3 . The dresser of  claim 1 , wherein the superabrasive particles in the first monolayer are a diamond material. 
     
     
         4 . The dresser of  claim 1 , wherein the superabrasive particles in the first monolayer are a cubic boron nitride material. 
     
     
         5 . The dresser of  claim 1 , wherein the superabrasive particles in the second monolayer include a member selected from the group consisting of diamond materials, nitride materials, ceramics, or a combination thereof. 
     
     
         6 . The dresser of  claim 1 , wherein the superabrasive particles in the second monolayer are a diamond material. 
     
     
         7 . The dresser of  claim 1 , wherein the superabrasive particles in the second monolayer are a cubic boron nitride material. 
     
     
         8 . The dresser of  claim 1 , further comprising a rigid support coupled to the second monolayer of superabrasive particles opposite the first monolayer. 
     
     
         9 . The dresser of  claim 1 , wherein at least one of the first monolayer of superabrasive particles or the second monolayer of superabrasive particles is coupled to the metal support layer with a braze alloy. 
     
     
         10 . The dresser of  claim 1 , wherein both the first monolayer of superabrasive particles and the second monolayer of superabrasive particles are coupled to the metal support layer with a braze alloy. 
     
     
         11 . The dresser of  claim 1 , wherein the superabrasive particles of the second monolayer are positioned to have the same distribution as the superabrasive particles of the first monolayer. 
     
     
         12 . A method of making a CMP pad dresser, comprising:
 disposing a first monolayer of superabrasive particles on a metal support layer;   disposing a second monolayer of superabrasive particles on the metal support layer on a side opposite the first monolayer, wherein the superabrasive particles of the second monolayer are positioned to have substantially the same distribution as the superabrasive particles of the first monolayer; and   bonding the first monolayer of superabrasive particles and the second monolayer of superabrasive particles to the metal support layer such that symmetrical forces due to the substantially similar distribution between the first monolayer and the second monolayer precludes substantial warping of the metal support layer.   
     
     
         13 . The method of  claim 12 , wherein the bonding of at least one of the first monolayer or the second monolayer is by brazing with a braze alloy. 
     
     
         14 . The method of  claim 12 , wherein the bonding of at least one of the first monolayer or the second monolayer is under heat and pressure. 
     
     
         15 . The method of  claim 14 , wherein the bonding of at least one of the first monolayer and the second monolayer further includes:
 disposing a sintering compound on the metal support layer in contact with at least one of the first monolayer or the second monolayer; and   sintering the sintering compound to bond the at least one of the first monolayer or the second monolayer to the metal support layer.   
     
     
         16 . The method of  claim 15 , further comprising infiltrating the sintering compound with a braze material during bonding. 
     
     
         17 . The method of  claim 14 , wherein the heat and pressure bonds at least one of the first monolayer or the second monolayer directly to the metal support layer. 
     
     
         18 . The method of  claim 12 , wherein the superabrasive particles of the second monolayer are positioned to align with the superabrasive particles of the first monolayer. 
     
     
         19 . The method of  claim 12 , further comprising coupling the second monolayer of superabrasive particles to a rigid support. 
     
     
         20 . The method of  claim 19 , wherein the coupling of the second monolayer of superabrasive particles to the rigid support is accomplished by a technique selected from the group consisting of hot pressing, brazing, sintering, soldering, electroplating, polymeric bonding, and combinations thereof. 
     
     
         21 . The method of  claim 19 , wherein the coupling of the second monolayer of superabrasive particles to the rigid support is accomplished by polymeric bonding. 
     
     
         22 . A method of minimizing warpage of a CMP pad dresser during manufacture, comprising:
 substantially equalizing warping forces on opposing sides of a metal support layer during bonding of a plurality of superabrasive particles thereto, wherein warpage of the support layer is minimized during bonding due to the equalized forces on opposing sides.   
     
     
         23 . The method of  claim 22 , wherein substantially equalizing forces includes arranging the plurality of superabrasive particles on opposing sides of the support layer such that the plurality of superabrasive particles has substantially the same distribution on either side of the support layer to substantially equalize warping forces during bonding.