Light source board unit

Abstract

Provided is an light source board unit enabling improved freedom in the shape and material for a resin part, suppression of increased costs, and compatibility of optical characteristics and physical characteristics. This light source substrate unit ( 1 ) is provided with a plurality of LED chips ( 2 ) and a base material ( 10 ) having a plurality of recesses ( 10 a ) in which the LED chips are mounted. The base material includes a first resin part ( 11 ) fabricated by injecting a first resin and a second resin part ( 12 ) fabricated by injecting a second resin. The first resin part and the second resin part have mutually different optical characteristics, and at least a portion of the inner surface of the recesses is formed by the second resin part.

1 . A light source board unit comprising:
 a plurality of light emitting devices, and   a base member that has a plurality of recess portions in which the light emitting devices are mounted, wherein   the base member includes a first resin portion obtained by injection-molding a first resin and a second resin portion obtained by injection-molding a second resin,   the first resin portion and the second resin portion have optical properties different from each other, and   at least part of an inner surface of the recess portion is formed of the second resin portion.   
     
     
         2 . The light source board unit according to  claim 1 , wherein
 the second resin portion has total light reflectance higher than the first resin portion.   
     
     
         3 . The light source board unit according to  claim 1 , wherein
 the second resin portion has a whitish color.   
     
     
         4 . The light source board unit according to  claim 1 , wherein
 the light emitting device emits bluish light,   the second resin portion contains a fluorescent material that converts the bluish light into yellowish light, and   the bluish light from the light emitting device and the yellowish light from the second resin portion are mixed with each other to obtain the whitish light.   
     
     
         5 . The light source board unit according to  claim 1 , wherein
 the first resin and the second resin are composed of a resin of an identical material, and   the first resin contains a physical property changing filler that changes a physical property.   
     
     
         6 . The light source board unit according to  claim 1 , wherein
 the first resin and the second resin are composed of a resin of an identical material, and   the second resin contains a reflectance improving filler that improves the total light reflectance.   
     
     
         7 . The light source board unit according to  claim 1 , wherein
 the first resin and the second resin are composed of resins of materials different from each other, and   at least part of a main surface of the base member and at least part of a rear surface of the base member are formed of the second resin portion.   
     
     
         8 . The light source board unit according to  claim 1 , wherein
 the recess portion has a bottom surface on which the light emitting device is mounted and an inner side surface that is disposed along a side of the light emitting device, and   at least parts of the bottom surface and the inner side surface are formed of the second resin portion.   
     
     
         9 . The light source board unit according to  claim 1 , wherein
 a seal resin layer is disposed in the recess portion, and   the seal resin layer contains a fluorescent material that converts the light from the light emitting device into light of a different color.   
     
     
         10 . The light source board unit according to  claim 1 , wherein
 the light emitting device is formed of a light emitting chip,   the base member is provided with a wiring layer, and   the light emitting chip is mounted on the bottom surface of the recess portion or on the wiring layer by means of bare chip mounting, and electrically connected to the wiring layer.   
     
     
         11 . The light source board unit according to  claim 10 , wherein
 the wiring layer is exposed to an inside of the recess portion, and   a silver layer is disposed on a surface of at least part of the wiring layer in the recess portion.   
     
     
         12 . The light source board unit according to  claim 10 , wherein
 the wiring layer is insert-molded or outsert-molded in the first resin portion, and   the first resin portion is insert-molded or outsert-molded in the second resin portion.   
     
     
         13 . The light source board unit according to  claim 1 , wherein
 the first resin portion and the second resin portion are molded in separate processes, and   the first resin portion and the second resin portion are integrally combined with each other to form the base member.   
     
     
         14 . The light source board unit according to  claim 13 , wherein
 the first resin portion and the second resin portion are fitted into each other to form the base member.   
     
     
         15 . The light source board unit according to  claim 13 , wherein
 the first resin portion and the second resin portion are bonded to each other to form the base member.   
     
     
         16 . The light source board unit according to  claim 1 , wherein
 the first resin portion and the second resin portion are formed integrally with each other by means of multicolor molding.   
     
     
         17 . The light source board unit according to  claim 1 , wherein
 the first resin portion and the second resin portion are integrally combined with each other by means of insert molding or outsert molding to form the base member.   
     
     
         18 . The light source board unit according to claim to  17 , wherein
 the second resin is added to the injection-molded first resin portion, insert-molded or outsert-molded to form the base member.   
     
     
         19 . The light source board unit according to  claim 1 , wherein
 the first resin portion and the second resin portion are formed integrally with each other by means of mixed color molding.   
     
     
         20 . The light source board unit according to claim to  19 , wherein
 the first resin portion and the second resin portion are formed integrally with each other by means of sandwich molding in which the first resin is used as a core resin and the second resin is used as a skin resin.