Substrate processing method, substrate processing apparatus and storage medium

Abstract

Productivity can be improved. A substrate processing method includes a processing liquid supplying process of supplying a processing liquid, which contains a volatile component and forms a film on a substrate, onto the substrate on which a pre-treatment, which requires atmosphere management or time management after the pre-treatment, is performed; and an accommodating process of accommodating, in a transfer container, the substrate on which the processing liquid is solidified or cured by volatilization of the volatile component.

We claim: 
     
         1 . A substrate processing method, comprising:
 a processing liquid supplying process of supplying a processing liquid, which contains a volatile component and forms a film on a substrate, onto the substrate on which a pre-treatment, which requires atmosphere management or time management after the pre-treatment, is performed; and   an accommodating process of accommodating, in a transfer container, the substrate on which the processing liquid is solidified or cured by volatilization of the volatile component.   
     
     
         2 . The substrate processing method of  claim 1 ,
 wherein the pre-treatment is a process in which a portion to be modified by being exposed to the atmosphere is formed on a surface of the substrate.   
     
     
         3 . The substrate processing method of  claim 1 , further comprising:
 a unloading process of taking out the substrate accommodated in the transfer container after the processing liquid supplying process; and   a removing process of removing the solidified or cured processing liquid from the substrate after the unloading process.   
     
     
         4 . The substrate processing method of  claim 3 , further comprising:
 a post-treatment process of performing a preset post-treatment on the substrate after the removing process.   
     
     
         5 . The substrate processing method of  claim 4 ,
 wherein the pre-treatment is a process in which dry etching or ashing is performed on the substrate before the processing liquid supplying process, and   the post-treatment is a process in which wet cleaning is performed on the substrate after the removing process.   
     
     
         6 . The substrate processing method of  claim 4 ,
 wherein the pre-treatment is a process in which dry etching or ashing is performed on the substrate before the processing liquid supplying process, and   the post-treatment is a process in which dry etching is performed on the substrate after the removing process.   
     
     
         7 . The substrate processing method of  claim 4 ,
 wherein the pre-treatment is a process in which a metal film is formed in the substrate before the processing liquid supplying process, and   the post-treatment is a process in which a metal film is formed on the substrate after the removing process.   
     
     
         8 . The substrate processing method of  claim 4 ,
 wherein the pre-treatment is a process in which wet cleaning is performed on the substrate before the processing liquid supplying process, and   the post-treatment is a process in which a metal film is formed on the substrate after the removing process.   
     
     
         9 . The substrate processing method of  claim 4 ,
 wherein the pre-treatment is a process in which wet cleaning is performed on the substrate before the processing liquid supplying process,   the processing liquid is a liquid of a sublimation material, and   in the removing process, the solidified or cured processing liquid is removed from the substrate by sublimation.   
     
     
         10 . The substrate processing method of  claim 1 , further comprising:
 an other surface process of processing, in a state that an entire main surface of the substrate is covered with the solidified or cured processing liquid, an other surface of the substrate.   
     
     
         11 . The substrate processing method of  claim 1 , further comprising:
 a pre-treatment process of performing the pre-treatment on the substrate.   
     
     
         12 . The substrate processing method of  claim 3 ,
 wherein, in the removing process, the solidified or cured processing liquid is removed from the substrate by supplying a removing liquid.   
     
     
         13 . The substrate processing method of  claim 12 ,
 wherein the removing liquid contains an anticorrosive material for a metal wiring formed in the substrate.   
     
     
         14 . A substrate processing apparatus, comprising:
 a mounting unit configured to mount thereon a transfer container accommodating a plurality of substrates therein;   a processing liquid supplying unit configured to supply a processing liquid, which contains a volatile component and forms a film on a substrate, onto the substrate on which a pre-treatment, which requires atmosphere management or time management after the pre-treatment, is performed; and   a substrate transfer device configured to transfer the substrate, on which the processing liquid is solidified or cured by volatilization of the volatile component, to the mounting unit and accommodate the substrate in the transfer container mounted on the mounting unit.   
     
     
         15 . The substrate processing apparatus of  claim 14 , further comprising:
 a pre-treatment unit configured to perform the pre-treatment on the substrate.   
     
     
         16 . The substrate processing apparatus of  claim 14 , further comprising:
 an other surface processing unit configured to process, in a state that an entire main surface of the substrate is covered with the solidified or cured processing liquid, an other surface of the substrate.   
     
     
         17 . The substrate processing apparatus of  claim 15 , further comprising:
 a first block including the pre-treatment unit;   a second block including the processing liquid supplying unit; and   a connecting unit that has an internal space blocked from an atmosphere and connects the first block and the second block to each other.   
     
     
         18 . A substrate processing apparatus comprising:
 a mounting unit configured to mount thereon a transfer container accommodating a plurality of substrates therein;   a removing unit configured to remove, from a substrate onto which atmosphere management or time management is performed by supplying a processing liquid, which contains a volatile component and forms a film on the substrate, on the substrate and by allowing the processing liquid to be solidified or cured by volatilization of the volatile component, the solidified or cured processing liquid;   a post-treatment unit configured to perform a preset post-treatment on the substrate from which the solidified or cured processing liquid is removed by the removing unit; and   a substrate transfer device configured to transfer the substrate, which is post-processed by the post-treatment unit, to the mounting unit and accommodate the substrate in the transfer container mounted on the mounting unit.   
     
     
         19 . The substrate processing apparatus of  claim 18 , further comprising:
 an other surface processing unit configured to process, in a state that an entire main surface of the substrate is covered with the solidified or cured processing liquid, an other surface of the substrate.   
     
     
         20 . The substrate processing apparatus of  claim 18 , further comprising:
 a first block including the mounting unit, the substrate transfer device and the post-treatment unit;   a second block including the removing unit; and   a connecting unit that has an internal space blocked from an atmosphere and connects the first block and the second block to each other.   
     
     
         21 . A computer-readable storage medium having stored thereon computer-executable instructions that, in response to execution, cause a substrate processing apparatus to perform a substrate processing method as claimed in  claim 1 .