US2015059204A1PendingUtilityA1
Segmented Insole for Support of Embedded Systems
Est. expirySep 4, 2033(~7.1 yrs left)· nominal 20-yr term from priority
A43B 17/006A43B 3/34A43B 3/0005A43B 13/386A43B 3/0084A43B 3/0031A43B 3/26
46
PatentIndex Score
0
Cited by
0
References
0
Claims
Abstract
A two part insole having one part for housing smart systems embedded within an insole, and a second part for maintaining comfort of a cut-to-fit insole to increase the functionality of the overall product for the user.
Claims
exact text as granted — not AI-modifiedWe claim:
1 . A segmented insole comprising:
a bottom, support layer; and a top, comfort layer, said top layer defining one or more surfaces designed to mate with said bottom layer; wherein said bottom layer is composed of a semi-rigid structural material and defines a cavity therein for holding an embedded device; and further wherein said top layer covers said bottom layer.
2 . The segmented insole of claim 1 further comprising one or more attachment points wherein said bottom layer and said top layer are attached to each other.
3 . The segmented insole of claim 1 further comprising an attachment method for attaching said bottom layer to said top layer at said one or more attachment points.
4 . The segmented insole claim 3 wherein said attachment method comprises an attachable and detachable material.
5 . The segmented insole of claim 3 wherein said attachment method comprises an adhesive.
6 . The segmented insole of claim 3 wherein said attachment method comprises friction-inducing fixtures, grooves, or pegs.
7 . The segmented insole of claim 1 wherein said top layer has cut-to-fit sizing lines.
8 . The segmented insole of claim 1 wherein said bottom layer and the portion of said top layer not covering said bottom layer each define a bottom surface, said bottom surface defining treads for engaging the base of a shoe into which said insole is disposed.
9 . The segmented insole of claim 1 wherein said top layer is composed of a shock-absorbing material.
10 . The segmented insole of claim 9 wherein said top layer is composed of a material which is softer than said bottom layer.
11 . The segmented insole of claim 9 wherein said shock-absorbing material is selected from a group consisting of gels, fabrics, foams, recycled materials and soft plastic materials.
12 . The segmented insole of claim 1 wherein semi-rigid structural material is selected from a group consisting of hard plastics, composites, metals, foams and recycled materials.
13 . The segmented insole of claim 3 wherein said attachment method consists of a cavity defined in said top layer for accepting insertion of said bottom layer therein.
14 . The segmented in sole of claim 13 wherein said cavity is composed of the same material as said top layer.
15 . The segmented insole of claim 13 wherein said cavity is composed of a fabric attached to said top layer.
16 . The segmented insole of claim 1 wherein said bottom layer defines one or more grooves or channels therein to allow for exposure of portions of said embedded device external to said insole.
17 . The segmented insole of claim 16 wherein said bottom layer comprises two parts which, when joined, encase said embedded system inside of said bottom layer.
18 . The segmented insole of claim 17 wherein said bottom layer permanently encases said embedded system.Join the waitlist — get patent alerts
Track US2015059204A1 — get alerts on status changes and closely related new filings.
We store only your email — no account needed. See our privacy policy.