Die release agent composition

Abstract

A die release agent composition is provided that is used by being applied to a die used for the squeeze casting, low-pressure casting, or the like of a metal or a die used for die forging. The die release agent composition includes a mineral oil or a synthetic oil, a solid lubricant, a thermosetting resin, and a polymer compound. The die release agent composition is used by being applied to the inner surface of a die for casting or forging.

What is claimed is: 
     
         1 . A die release agent composition comprising:
 a mineral oil or a synthetic oil;   a solid lubricant;   a thermosetting resin; and   a polymer compound,   wherein the die release agent composition is used by being applied to an inner surface of a die for casting or forging.   
     
     
         2 . The die release agent composition according to  claim 1 ,
 wherein the solid lubricant is at least one of talc, boron nitride, graphite, mica, molybdenum disulfide, and fullerene.   
     
     
         3 . The die release agent composition according to  claim 1 ,
 wherein an average particle diameter of the solid lubricant is in a range between 0.5 micrometers and 30 micrometers, and   wherein a content of the solid lubricant is in a range between 1 mass percentage and 10 mass percentages when a total content of the mineral oil or the synthetic oil, the solid lubricant, the thermosetting resin, and the polymer compound is 100 mass percentages.   
     
     
         4 . The die release agent composition according to  claim 1 ,
 wherein the thermosetting resin is at least one of a phenol resin, an epoxy resin, a urea resin, a melamine resin, an alkyd resin, and an unsaturated polyester resin.   
     
     
         5 . The die release agent composition according to  claim 1 ,
 wherein the thermosetting resin provides a binder when the die release agent composition is applied to the die, and   wherein the thermosetting resin is decomposed at a temperature during forming.   
     
     
         6 . The die release agent composition according to  claim 1 ,
 wherein, when a number average molecular weight of the thermosetting resin is in a range between 5,000 and 500,000 and a forming temperature is in a range between 300 and 550° C., an adhesion strength is in arrange between 0.1 MPa and 5.0 MPa.   
     
     
         7 . The die release agent composition according to  claim 1 ,
 wherein the polymer compound is at least one of a synthetic wax and a natural wax.   
     
     
         8 . The die release agent composition according to  claim 1 ,
 wherein the polymer compound is at least one of the synthetic wax and polybutene.   
     
     
         9 . The die release agent composition according to  claim 8 ,
 wherein, when a temperature of the die during the application of the die release agent composition thereto is equal to or higher than 250° C. and lower than 400° C., the polybutene is used and,   wherein, when the temperature of the die during the application of the die release agent composition thereto is equal to or higher than 400° C. and equal to or lower than 550° C., the synthetic wax is used.