Power Inverter

Abstract

In a power inverter, a coolant passage is fixed to a chassis to cool the chassis; the chassis is divided into a first region and a second region by providing the coolant passage in the chassis; a power module is provided in the first region as fixed to the coolant passage; a capacitor module is provided in the second region; and the DC terminal of the capacitor module is directly connected to the DC terminal of the power module.

What is claimed is: 
     
         1 . A power inverter, comprising:
 a first power module that comprises an upper arm circuit and a lower arm circuit and performs power conversion; and   a chassis that forms a passage, wherein;   the first power module comprises a first semiconductor element that constitutes the upper arm circuit, a second semiconductor element that constitutes the lower arm circuit, and a first metal base that supports the first semiconductor element and the second semiconductor element;   the passage is formed by a first passage, a second passage that is disposed beside the first passage, and a return passage that connects the first pasage with the second passage;   the chassis forms a partition wall that separates the first passage and the second passage, a first opening that opens to the first passage, and a second opening that opens to the second passage;   the first metal base includes a first fin that is formed in a position facing the first semiconductor element and a second fin that is formed in a position facing the second semiconductor element; and   the first metal base is disposed over the partition wall and closes the first opening and the second opening such that the first fin protrudes into the first opening and the second fin protrudes into the second opening.   
     
     
         2 . The power inverter according to  claim 1 , further comprising:
 a second power module that comprises an upper arm circuit and a lower arm circuit and performs power conversion, wherein:   the second power module comprises a third semiconductor element that constitutes the upper arm circuit, a fourth semiconductor element that constitutes the lower arm circuit, and a second metal base that supports the third semiconductor element and the fourth semiconductor element;   the second metal base includes a third fin that is formed in a position facing the third semiconductor element and a fourth fin that is formed in a position facing the fourth semiconductor element; and   the second metal base is disposed over the partition wall and closes the first opening and the second opening such that the third fin protrudes into the first opening and the fourth fin protrudes into the second opening.   
     
     
         3 . The power inverter according to  claim 1 , further comprising:
 a positive conductor and a negative conductor that transmit direct current to the first power module, wherein:   the positive conductor and the negative conductor are arranged so as to face the first semiconductor element held on the first metal base, and form a laminated structure by sandwiching an insulation member.