US2015053774A1PendingUtilityA1

Methods to fabricate integrated circuits by assembling components

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Assignee: TERPACPriority: Jun 14, 2009Filed: Oct 27, 2014Published: Feb 26, 2015
Est. expiryJun 14, 2029(~2.9 yrs left)· nominal 20-yr term from priority
Inventors:Jayna Sheats
H10W 90/752H10W 90/722H10W 90/20H10W 72/9445H10W 72/9415H10W 72/07535H10W 72/07533H10W 72/07504H10W 72/07236H10W 72/07232H10W 72/07141H10W 72/5525H10W 72/5524H10W 72/5363H10W 72/01225H10W 72/01223H10W 72/951H10W 72/932H10W 72/923H10W 72/552H10W 72/534H10W 72/251H10W 72/241H10W 72/072H10W 72/60H10W 72/59H10W 72/29H10W 90/00H10W 72/50H10W 72/20G06K 19/07754G06K 19/07752H10D 62/117H01L 2224/05026H01L 2224/05013H01L 2924/06H01L 2924/1434H01L 2224/04042H01L 2924/1431H01L 25/18H01L 24/06H01L 2924/2064H01L 2224/06179H01L 2924/1421
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Claims

Abstract

The present invention discloses methods and apparatuses for the separations of IC fabrication and assembling of separated IC components to form complete IC structures. In an embodiment, the present fabrication separation of an IC structure into multiple discrete components can take advantages of dedicated IC fabrication facilities and achieve more cost effective products. The present process can fabricate multiple components separately before assembling them into a complete integrated circuit. In an aspect, the ready-for-assembling components are taken directly from processed wafers without any additional assembling processes, and/or having lateral dimensions less than 1 mm.

Claims

exact text as granted — not AI-modified
What is claimed is: 
     
         1 . An integrated circuit comprising multiple functional components assembled together through bond pad connections, wherein at least a functional component has a lateral dimension less than 0.5 mm and a thickness less than 100 microns. 
     
     
         2 . An integrated circuit as in  claim 1  wherein the multiple functional components are assembled using a photosensitive thermally decomposable polymer. 
     
     
         3 . An integrated circuit as in  claim 1  wherein the multiple functional components are assembled using a thermal adhesion transfer process. 
     
     
         4 . An integrated circuit as in  claim 1  wherein the multiple functional components are assembled in an at least partially stacked configuration. 
     
     
         5 . An integrated circuit as in  claim 1  wherein the multiple functional components are assembled in an at least partially coplanar configuration. 
     
     
         6 . An integrated circuit as in  claim 1  wherein the at least a functional component has a lateral dimension less than 0.1 mm. 
     
     
         7 . An integrated circuit as in  claim 1  wherein at least two functional components are assembled close than 100 microns from each other. 
     
     
         8 . An integrated circuit as in  claim 1  wherein at least a functional component comprises an integrated circuit. 
     
     
         9 . An integrated circuit as in  claim 7  wherein the integrated circuit comprises a radio frequency identification (RFID) circuit. 
     
     
         10 . A radio frequency identification (RFID) circuit comprising a logic component, a memory component and a RF component assembled together through bond pad connections, wherein at least a component has a lateral dimension less than 1 mm and a thickness less than 100 microns. 
     
     
         11 . A RFID circuit as in  claim 1  wherein the components are assembled using a photosensitive thermally decomposable polymer. 
     
     
         12 . A RFID circuit as in  claim 1  wherein the components are assembled in an at least partially stacked configuration. 
     
     
         13 . A RFID circuit as in  claim 1  wherein the components are assembled in an at least partially coplanar configuration. 
     
     
         14 . A RFID circuit as in  claim 1  wherein the at least a component has a lateral dimension less than 0.1 mm. 
     
     
         15 . A RFID circuit as in  claim 1  wherein the at least a component has a lateral dimension less than 0.5 mm. 
     
     
         16 . A RFID circuit as in  claim 1  wherein at least two components are assembled close than 100 microns from each other. 
     
     
         17 . A RFID circuit as in  claim 1  wherein the at least a component comprises a digital logic integrated circuit. 
     
     
         18 . A RFID circuit as in  claim 1  wherein the RF component comprises an antenna having bond pads for connecting to the logic component. 
     
     
         19 . A RFID circuit as in  claim 1  wherein the components are placed so that a first component face down on top of a second component so that the bond pads in the first component line up with the bond pads in the second component. 
     
     
         20 . A radio frequency identification (RFID) circuit comprising a logic component, and a RF component assembled together through bond pad connections, wherein at least one component has a lateral dimension less than 1 mm and a thickness less than 100 microns.

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